Institute of Microengineering and Nanoelectronics

 Institute of Microengineering and Nanoelectronics

Dr. Roslina Binti Ismail

Research Fellow / Senior Lecturer

Phone. +603 89**
E-mail: roslina.ismail@ukm.edu.my

 

EDUCATIONS

  • 2015-2017, Masters in Art (Fine Arts; Major: Painting), Universiti Teknologi MARA (2015-2017)
  • 2005-2010, PhD. in Engineering(Advanced Materials and Nanotechnology), University of Malaya
  • 2001-2003, Masters in Engineering Science(Advanced Materials and Engineering), University of Malaya, Malaysia (2001-2003)
  • 1991-1993, Bachelor of Science (Hons.), Chemistry, Major: Technology, University of Manchester, Inst. of Science and technology (UMIST)

 

RESEARCH INTEREST

Electronic packaging, biomimicry and nanotechnology

 

WORK EXPERIENCES

  • October 2016- now, Research Fellow (Permanent) at Institute of Microelectronics and Nanoengineering (IMEN), Universiti Kebangsaan Malaysia (National University of Malaysia)
  • 2012-2014, Technical Consultant at EFGO Scientific Sdn. Bhd.
    Kulim HiTech, Kulim Kedah, Malaysia
  • 2010-2012, Senior Lecturer at School of Engineering, Taylor’s University, Malaysia
  • 2004-2005, Lecturer at Dept. of Mechanical Engineering, Universiti Malaya
  • 2001-2004, Tutor and Lab Demonstrator at Dept. of Mechanical Engineering, Universiti Malaya
  • 1994-1998, Lecturer at Faculty of Applied Science, UiTM, Shah Alam

 

RESEARCH GRANTS

  • 2009-2010 UM Short Term Research Grant – RM 27,000
  • 2007-2009 Sciencefund, MOSTI – RM 162,540
  • 2006-2007 FFP Research Grant, UM – RM 36,000
  • 2005-2007 Sultan Iskandar Johor Foundation – Tuition Fees +Monthly Stipend
  • 2003-2004 UM Vot F Short Term Research Grant -RM10,000
  • 2002-2003 UM Vot F Short Term Research Grant- RM4,000
  • 2001-2003 Skim Pascasiswazah UM –Tuition fees + Monthly Stipend
    1992-1993 MARA Scholarship

 

PUBLICATIONS

  1. Deformation Behaviour of Sn-3.0Ag-0.5Cu Solder Wire Under Varied Tensile Strain Rates Soldering and Surface Mount Technology (In Press) SAC-xTiO2 nano-reinforced lead free solder joint characterizations in ultra-fine package assembly Materials and Design (In Press)
    2016
  2. R Ismail, F Harun, A Jalar, S Abdullah – Materials Science Forum, 2016, Mechanical Interlocking on Leadframe Surface for Bondability of Au Wedge Bond.
  3. M Abu Bakar, A Jalar, R Ismail, AR Daud – Materials Science Forum, 2016, Nanoindentation of Sn3. 0Ag0. 5Cu/ENIG Solder Joint after High Temperature Storage.
  4. M Abu Bakar, A Jalar, R Ismail, AR Daud – Materials Science Forum, 2016, Wettability of CNT-doped Solder Under Isothermal Aging.
  5. R Ismail, F Harun, A Jalar, S Abdullah – Materials Science Forum, 2016, Ultrasonic Vibration In Leadframe For The Bondability For Au Wedge Bond.
  6. MA Bakar, A Jalar, R Ismail, AR Daud – Materials Science Forum, 2016, Directional Growth Behaviour of Intermetallic Compound of Sn3. 0Ag0. 5Cu/ImSn subjected to Thermal Cycling.
  7. N Ismail, R Ismail, NKAN Ubaidillah, A Jalar, NM Zain – Materials Science Forum, Surface Roughness and Wettability of SAC/CNT Lead Free Solder.
  8. Ismail, R., Harun, F., Zulkifli, M.N., Jalar, A., Bakar, M.A. & Abdullah, S. 2015. Bondability of Second Copper Wire Bonds on Silver and Nickel–Palladium–Gold–Silver Metallization. IEEE Transactions On Components, Packaging And Manufacturing Technology, 5(10): 1541-1545.
  9. Ismail, R., Omar, G., Jalar, A. & Majlis, B.Y. 2015. The Influence of Pd-Doped Au Wire Bonding on HAZ Microstructure and Looping Profile in MicroElectromechanical Systems (MEMS) Packaging. Journal of Electronic Materials 44(7): 2507-2513.
  10. Ani, F.C., Jalar, A., Ismail, R., Othman, N.K., Abdullah, M. Z. & Aziz, M.S.A. 2015. Reflow Optimization Process: Thermal Stress Using Numerical Analysis and Intermetallic Spallation in Backwards Compatibility Solder Joints. Arabian Journal for Science and Engineering 40(6): 1669-1679.
  11. Yahya, S. Othman, N.K., Daud, A.R., Jalar, A. & Ismail, R. 2015. The influence of temperature on the inhibition of carbon steel corrosion in acidic lignin. AntiCorrosion Methods and Materials 62(5): 301-306.
  12. Harun, F., Ismail, R., Jalar, A. & Abdullah, S. 2015. Effect of wire diameter and hook location on second bond failure modes. Microelectronics International 32(1):32-36.
  13. Yusoff, W.Y.W. Ismail, R., Jalar, A., Othman, N.K. & Rahman, I.A. 2014. Microstructural evolution and micromechanical properties of gamma-irradiated Au ball bonds. Materials Characterization 93: 129-135.
  14. S. M. Yusof, J. Jai, M. A. Hashim, R. Ismail, A. Hadi, Surface Morphology Study: Effect of Electrolyte pH on the Electrodeposited SnAg-Cu (SAC) Solder Alloy” Applied Mechanics and
    Materials, Vol. 575, pp. 481-485, Jun. 2014, DOI: 10.4028/www.scientific.net/AMM.575.481 Scopus Indexed; TTP
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