Dr. Maria Abu Bakar

Senior Lecturer / Research Fellow

Phone: 0138561667
Email: maria@ukm.edu.my
ORCID ID: 0000-0002-9745-3334

 

EDUCATIONAL QUALIFICATIONS

2007 Bachelor of Science, 2007, Materials Science, UKM, Malaysia
2013 Master of Science, Materials Science, UKM Malaysia
2017 Doctor of Philosophy, IMEN-UKM Malaysia

 

RESEARCH AREA:

1. Materials Science
2. Electronic Packaging
3. Microstructure-properties-performance-materials relationship

 

RESEARCH EXPERIENCES:

2008-2012: Graduate Research Assistance (GRA), School of Applied Physics,
Faculty of Science and Technology, UKM Bangi, 2008-2012.
2013-2017: Graduate Research Assistance (GRA), Institute of
Microengineering and Nanoelectronics (IMEN), UKM
2017-2018: Post-doctoral researcher, Institute of Microengineering and
Nanoelectronics (IMEN), UKM Bangi

 

AWARDS:

1. Best Poster Award, the Electronic Packaging Interconnect Technology
Symposium (EPITS), 21 November 2015, Pulau Pinang.
2. Bronze Award for innovation “Mechanical Properties of Microelectronic
Package for Military Device Applications”, 10-11 Julai 2017, Kuala Lumpur.

 

SELECTED PUBLICATIONS:

  1.  Maria Abu Bakar, Azman Jalar, Roslina Ismail. 2018. Kesan kemasan permukaan berbeza terhadap sifat mikromekanik sambungan pateri SAC 0307  menggunakan pendekatan pelekukan nano (Effect of different surface finishes on micromechanical properties of SAC 0307 solder joint using nanoindentation approach). Sains Malaysiana 47(5)(2018): 1011–1016. ISI Q3. IF (2017): 0.565.
  2. Maria Abu Bakar, Azman Jalar, Roslina Ismail. 2018. Penilaian semula pengukuran kuantitatif stereometri terhadap pertumbuhan sebatian antara logam bagi sambungan pateri (Reassessment of stereometric quantitative  measurements on the growth of intermetallic compound for solder connections). Sains Malaysiana 47(4)(2018): 805-810. ISI Q3. IF (2017): 0.565.
  3. Azman Jalar, Maria Abu Bakar, Roslina Ismail, Najib Saedi Ibrahim, Mohd Ariffin Ambak. 2018. Kesan pigment pewarna terhadap pertumbuhan sebatian antara logam sambungan pateri Sn-3.0Ag-0.5Cu (Effect of coloured pigment on intermetallic compound growth of Sn-3.0Ag-0.5Cu solder joint). Sains Malaysiana 47(4)(2018): 1005-1010. ISI Q3. IF (2017): 0.565.
  4. Norliza Ismail, Azman Jalar, Maria Abu Bakar & Roslina Ismail. Effect of carbon nanotube addition on the growth of intermetallic layer of Sn-Ag-Cu solder system under thermal aging (Kesan penambahan tiubnano karbon terhadap pertumbuhan lapisan sebatian antara logam sistem pateri Sn-Ag- Cu/Cu akibat penuaan terma). Sains Malaysiana 47(7)2018: 1585-1590. ISI Q3. IF (2017): 0.565.
  5. Maria Abu Bakar, Azman Jalar, Mohd Zulkifly Abdullah, Najib Saedi Ibrahim & Mohd Ariffin Ambak. Pengawalan pertumbuhan sebatian antara logam sambungan pateri-papan litar bercetak menggunakan salutan nikel (Controlling of intermetallic compound solder interconnection-printed circuit board using nickel coating). Accepted to be published in Sains  Malaysiana. ISI Q3. IF (2017): 0.565.
  6. Wilfred Paulus, Irman Abdul Rahman, Azman Jalar, Norinsan Kamil Othman, Roslina Ismail, Wan Yusmawati Wan Yusoff & Maria Abu Bakar. 2017. The Relationship between XRD Peak Intensity and Mechanical Properties of Irradiated Lead-Free Solder. Materials Science Forum 888: 423-427.
  7. Azman Jalar, Maria Abu Bakar, Roslina Ismail, Abdul Razak Daud. 2016. Statistical aspect on the measuring of intermetallic compound thickness of  lead free solders. Journal of Scientific Research and Development 3 (4): 49-54. IF: 1.69.
  8. Maria Abu Bakar, Azman Jalar, Abdul Razak Daud, Roslina Ismail, Najib Saedi Ibrahim. 2016. Micromechanical properties of solder joint Sn3.0Ag0.5Cu on Electroless Nickel immersion gold (ENIG) using Nanoindentation approach. International Journal of Advanced and Applied Sciences, 3(2): 1‐5. IF: 0.601.
  9. Maria Abu Bakar, Azman Jalar, Abdul Razak Daud, Roslina Ismail, Nur Azida Che Lah & Najib Saedi Ibrahim. 2016. Nanoindentation Approach on Investigating Micromechanical Properties of Joining from Green Solder Materials (Kaedah Perlekukan Nano dalam Mengkaji Sifat Mikromekanik Sambungan Bahan Aloi Pateri Hijau). Sains Malaysiana 45(8): 1275–1279. IF
    (2016): 0.470.
  10. Maria Abu Bakar, Azman Jalar, Roslina Ismail and Abdul Razak Daud. 2016. Directional Growth Behaviour of Intermetallic Compound of  Sn3.0Ag0.5Cu/ImSn subjected to Thermal Cycling. Materials Science Forum 857: 36-39.