Institute of Microengineering and Nanoelectronics

 Institute of Microengineering and Nanoelectronics

MoU

 

No. Colaboration Partner Activity Duration
1 JAIST, Japan Research fellow exchange, joint project, research facility 2014-now
2 Chiao Tung University, Taiwan Research fellow exchange, joint project 2014-now
3 Micro Materials Ltd., UK Industrial partner 2010-now
4 Applied Science Technology Research Institute (ASTRI), Hong Kong Member of consortium 2010-now
5 Universitas Padjajaran (UNPAD), Indonesia Research colaboration on solar cells 2010-now
6 Universiti Tenaga National, Malaysia Research colaboration on electronics materials 2009-now
7 EFGO Scientific Sdn Bhd, Malaysia Research and industrial partner 2009-now
8 MIXSIG Sdn Bhd, malaysia Industrial partner 2009-now
9 AIC Semiconductor Sdn Bhd, MalaysiaIndustrial partner Research colaboration on 3D QFN Stacked Die Package 2007-now
10 Universiti Malaya, Malaysia Research colaboration on 3D QFN Stacked Die Package 2008-now
11 SIRIM Berhad, Malaysia Research colaboration 2008-now
12 Universiti Putra Malaysia, Malaysia Research colaboraton on magnetic devices 2008-no3
13 Kyungpook University, Korea Research colaboration, joint seminar 2007-now
14 Connect County Holding Berhad, Malaysia Industrial partner 2006-now
15 Institut Teknologi Bandung  (ITB), Indonesia Joint symposium 2006-now
16  Telekom R&D Research fellow association, joint facility  1996-now
Translate »