Fabrication

mems1   mems2   mems3

Deposition

  1. LPCVD Oxidation Three Stack Furnace (KoyoLab)
  2. DWL 66 Laser Write (Heidelberg DWL)
  3. Plasma Enhanced Chemical Vapour Deposition (PECVD)
  4. E-Beam Evaporator (Edwards Auto 306 Turbo)
  5. Metal evaporator (Med 010 Balzers)
  6. Sputter Coater (Baltec SCD-005)
  7. Oxidation Furnace
  8. DC/RF Sputtering System (NTI Nanofilm)

Etching

  1. ICP PlasmaLab System 100 (Deep RIE)
  2. Electrochemical Etch System (MEMS Potentiostat SC)
  3. Plasma Enhanced Chemical Vapour Deposition (RIE)

Lithography

  1. Karl-Suss MJB Mask Aligner (Karl Suss)
  2. Ceramic Hotplate (Fischer Scientific)
  3. Coating Dispensing System – resist spinner (Spin Coater P6700)
  4. Resist Spin Coater (Mikasa SpinCoater 1H-D3)
  5. Thermolyne Hotplate (Thermolyne)
  6. Programmable Spin CoaterOther machines / facilities

Other machines / facilities

  1. Wire bonding system (Kulicke & soffa 4500 Digital series)
  2. Ultrasonic Cleaner (Brinson 1200)
  3. Ozone cleaner (UVO cleaner 144AX-220)
  4. Wafer scriber (Karl Suss)
  5. General purpose oven
  6. DI water system
  7. Portable Liquid N2 tank
  8. Chemical freezer
  9. Wet station
  10. Eye wash station
  11. Fumehood / Wetbench