Sains Malaysiana 47(4)(2018): 805-810

http://dx.doi.org/10.17576/jsm-2018-4704-20

 

Penilaian Semula Pengukuran Kuantitatif Stereometri terhadap Pertumbuhan Sebatian antara Logam bagi Sambungan Pateri

(Reassessment of Stereometric Quantitative Measurements on the Growth of Intermetallic Compound for Solder Connections)

 

MARIA ABU BAKAR, AZMAN JALAR* & ROSLINA ISMAIL

 

Pusat Pengajian Fizik Gunaan, Fakulti Sains dan Teknologi, Universiti Kebangsaan Malaysia,

43600 UKM Bangi, Selangor Darul Ehsan, Malaysia

 

Received: 29 August 2017/Accepted: 10 November 2017

 

ABSTRAK

 

Pencerapan dua dimensi (2D) yang diperoleh daripada keratan rentas sampel selalunya digunakan untuk mendapatkan maklumat ketebalan lapisan sebatian antara logam (IMC). Walau bagaimanapun, pencerapan 2D amatlah terhad berbanding maklumat yang sepatutnya diperoleh daripada struktur tiga dimensi (3D) sampel. Kajian ini bertujuan untuk menilai semula kaedah pengukuran lapisan IMC daripada pemerhatian 2D dengan mempertimbangkan faktor-faktor sebenar dalam bentuk 3D IMC. Nilai mod ketebalan didapati lebih mewakili nilai ketebalan IMC setelah mempertimbangkan pelbagai faktor stereometri berbanding dengan nilai purata. Ini memberikan suatu penanda aras dalam aktiviti menentukan ketebalan lapisan IMC berdasarkan pencerapan 2D daripada struktur 3D.

 

Kata kunci: Ketebalan pertumbuhan sebatian antara logam; metalografi kuantitatif; pertumbuhan sebatian antara logam; stereologi

 

ABSTRACT

 

Two-dimensional observation (2D) obtained from cross-section of the sample is often used to obtain the intermetallic compound (IMC) thickness. However, 2D observation is limited compared to the information that should be obtained from a three-dimensional (3D) sample structure. This study aimed to re-evaluate the IMC layer measurement method from 2D observation by considering real factors in the form of 3D IMC. Thickness mode values are more represent the IMC’s thickness value by considering various stereometric factors as compared to average values. This provides a benchmark in the activity of determining the IMC layer thickness based on 2D’s observation from the 3D structure.

 

Keywords: Intermetallic compound growth; intermetallic compound thickness; quantitative metallography; stereology

 

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*Corresponding author; email: azmn@ukm.edu.my