Sains Malaysiana 49(12)(2020): 3045-3054

http://dx.doi.org/10.17576/jsm-2020-4912-16

Effect of Isothermal Aging and Copper Substrate Roughness on the SAC305 Solder Joint Intermetallic Layer Growth of High Temperature Storage (HTS)

(Kesan Penuaan Isoterma dan Kekasaran Permukaan Substrat Kuprum ke atas Pertumbuhan Lapisan antara Logam Sambungan Pateri SAC305 pada Penyimpanan Suhu Tinggi (HTS))

RABIAH AL ADAWIYAH AB RAHIM¹, MUHAMMAD NUBLI ZULKIFLI², AZMAN JALAR^1,3*, ATIQAH MOHD AFDZALUDDIN¹ & KIM SIOW SHYONG¹

¹Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Selangor Darul Ehsan, Malaysia

²Universiti Kuala Lumpur (UniKL), British Malaysia Institute (BMI), Electrical Engineering Section, Jalan Sungai Pusu, 53100 Gombak, Selangor Darul Ehsan, Malaysia

³Department of Applied Physics, Faculty of Science & Technology, Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Selangor Darul Ehsan, Malaysia

Received: 13 August 2020/Accepted: 27 August 2020

ABSTRACT

This study aims to evaluate the effect of copper (Cu) substrate surface roughness on the intermetallic compound (IMC) growth and interfacial reaction of SAC305 lead-free solder joint after undergone an aging process. Aging process was conducted using high temperature storage (HTS) at temperature of 150 °C and aging times of 200, 400, 600, 800, and 1000 h. IMC morphology and growth were examined using infinite focus microscope (IFM). Then, the SAC305 solder joint IMC growth kinetic was measured based on power law relationship and diffusion coefficient formula. It was noted that the morphology of IMC for the rougher Cu substrate has scallop-shaped and uniform layer as compared to that of smoother Cu substrate for the initial exposure to the HTS. In addition, Cu substrate with R_a of 579 nm is the turning point for the creation of Cu₆Sn₅ towards more Cu₃Sn of IMC. In addition, Cu substrate with R_a of 579 nm also acts as the turning point for the IMC growth of SAC305 solder joint on Cu substrate for the solid-state diffusion to be happened during 150 °C of aging from grain boundary dominant toward volume diffusion dominant.

Keywords: High temperature storage (HTS); IMC layer growth, IMC thickness; SAC305 solder; substrate roughness

ABSTRAK

Kajian ini bertujuan untuk menilai kesan kekasaran permukaan substrat kuprum (Cu) ke atas pertumbuhan lapisan sebatian antara logam (IMC) dan tindak balas antara muka sambungan pateri SAC305 selepas melalui proses penuaan. Proses penuaan dijalankan menggunakan penyimpanan suhu tinggi (HTS) pada suhu 150 °C dan masa penuaan 200, 400, 600, 800 dan 1000 jam. Morfologi dan pertumbuhan IMC dicerap menggunakan mikroskop fokus tak terjangka (IFM). Kemudian, pertumbuhan kinetik sambungan pateri SAC305 diukur berdasarkan hubungan hukum kuasa dan formula pekali resapan. Morfologi IMC untuk substrat Cu yang lebih kasar menunjukkan ia berbentuk kerangan dan lapisan yang seragam berbanding substrat Cu yang lebih licin untuk permulaan pendedahan kepada HTS. Sebagai tambahan, substrat Cu dengan 579 nm R_a merupakan titik permulaan kepada pertumbuhan IMC sambungan pateri SAC305 di atas substrat Cu untuk resapan keadaan pepejal berlaku semasa penuaan 150 °C daripada dominan sempadan terhadap dominan resapan isi padu.

Kata kunci: Kekasaran substrat; ketebalan IMC; penyimpanan suhu tinggi (HTS); pertumbuhan lapisan IMC; pateri SAC305

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*Corresponding author; email: azmn@ukm.edu.my