Sains Malaysiana 47(7)(2018): 1585–1590

http://dx.doi.org/10.17576/jsm-2018-4707-29

 

Kesan Penambahan Tiubnano Karbon terhadap Pertumbuhan Lapisan Sebatian antara Logam Sistem Pateri Sn-Ag-Cu/Cu akibat Penuaan Terma

(Effect of Carbon Nanotube Addition on the Growth of Intermetallic Layer of Sn-Ag-Cu Solder System under Thermal Aging)

 

NORLIZA ISMAIL¹, AZMAN JALAR^1*, MARIA ABU BAKAR¹ & ROSLINA ISMAIL²

 

¹Institute of Microengineering and Nanoelectronic (IMEN), Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Selangor Darul Ehsan, Malaysia

 

²Division of Fine Arts, Cultural Centre, University of Malaya (UM), 50603 Kuala Lumpur, Wilayah Persekutuan, Malaysia

 

Diserahkan: 15 September 2017/Diterima: 8 Mac 2018

 

 

ABSTRAK

Kesan tiubnano karbon (CNT) terhadap pertumbuhan lapisan sebatian antara logam (IMC) bagi sistem pateri bebas plumbum 96.5Sn-3.0Ag-0.5Cu/substrat Cu telah dikaji. Serbuk aloi Sn-Ag-Cu (SAC305) dicampurkan dengan 0.02 peratus berat CNT untuk menghasilkan pes pateri SAC305-CNT. Kedua-dua pes pateri SAC305 dan SAC305-CNT dicetak secara manual di atas permukaan papan litar bercetak (PCB) dengan kemasan kuprum (Cu) menggunakan kaedah percetakan stensil. Sampel yang telah dicetak dikenakan proses pematerian aliran semula pada suhu 260°C. Sampel yang sudah terpateri dikenakan ujian penuaan terma selama 200, 400, 600, 800 dan 1000 jam menggunakan ketuhar penyimpanan suhu tinggi (HTS) pada suhu malar iaitu 150°C. Ketebalan lapisan sebatian antara logam (IMC) diukur menggunakan alat Pengukuran Fokus Tak Terhingga (IFM®). Keputusan kajian mendapati kadar pertumbuhan lapisan IMC bagi sistem SAC305/Cu-CNT adalah 25% lebih rendah berbanding dengan sistem SAC/Cu. Maka, dicadangkan bahawa penambahan CNT boleh merencatkan pertumbuhan lapisan IMC sebanyak 25% akibat penuaan terma.

 

Kata kunci: Jerapan tiubnano karbon; pateri Sn-Ag-Cu; pertumbuhan lapisan antara logam; resapan; tiubnano karbon

 

ABSTRACT

Effect of carbon nanotube (CNT) on the growth of intermetallic compound (IMC) layer of 96.5Sn-3.0Ag-0.5Cu/Cu substrate lead free solder system has been investigated. Sn-Ag-Cu alloy powder (SAC305) was mixed with 0.02 weight percent of CNT to produce SAC-CNT solder paste. Both SAC305 and SAC305-CNT solder paste has been manually printed on the printed circuit board (PCB) with the copper (Cu) surface finish by using stencil printing method. Printed samples were reflowed at temperature 260°C. Soldered samples underwent thermal aging test for the period of 200, 400, 600, 800 and 1000 h using high temperature storage (HTS) oven at a constant temperature 150°C. The thickness of IMC layer was measured by Infinite Focus Measurement (IFM®) equipment. The results found that growth rates of IMC layer for SAC305/Cu-CNT system is 25% lower than SAC/Cu system. Therefore, addition of CNT proposed can retard about 25% of IMC layer growth under thermal aging.

 

Keywords: Carbon nanotube; carbon nanotube adsorption; diffusion; intermetallic layer growth; Sn-Ag-Cu solder

  RUJUKAN

Bakar, M.A., Jalar, A., Daud, A.R., Ismail, R., Lah, N.A.C. & Ibrahim, N.S. 2016. Nanoindentation approach on investigating micromechanical properties of joining from green solder materials. Sains Malaysiana 45(8): 1275-1279.

Chang, S.Y., Jain, C.C., Chuang, T.H., Feng, L.P. & Tsao, L.C. 2011. Effect of addition of TiO₂ nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder. Materials and Design 32: 4720-4727.

Dele-Afolabi, T.T., Hanim, M.A., Norkhairunnisa, M., Yusoff, H.M. & Suraya, M.T. 2015. Growth kinetics of intermetallic layer in lead-free Sn-5Sb solder reinforced with multi-walled carbon nanotubes. Journal Mater Sci: Mater Electron. 26: 8249-8259.

Eid, E.A., Fouda, A.N. & Duraia, E.S.M. 2016. Effect of adding 0.5 wt% ZnO nanoparticles, temperature and strain rate on tensile properties of Sn–5.0 wt% Sb–0.5 wt% Cu (SSC505) lead free solder alloy. Materials Science and Engineering: A 657: 104-114.

Han, Y.D., Jing, H.Y., Nai, S.M.L., Xu, L.Y., Tan, C.M. & Wei, J. 2012. Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn-Ag-Cu solder joints during thermal cycling. Intermetallics 31: 72-78.

Han, Y.D., Jing, H.Y., Nai, S.M.L., Xu, L.Y., Tan, C.M. & Wei, J. 2009. Effect of Ni-coated carbon nanotubes on interfacial intermetallic layer growth. Electronics Packaging Technology Conference. pp. 292-295.

Harris, P.G. & Chaggar, K.S. 1998. The role of intermetallic compound in lead-free soldering. Soldering & Surface Mount Technology 10(3): 38-52.

Kang, S.K., Choi, W.K., Yim, M.J. & Shih, D.Y. 2002. Studies of the mechanical and electrical properties of lead-free solder joints. Journal of Electronic Materials 31(11): 1292-1303.

Kim, D. & Jung, S. 2005. Interfacial reactions and growth kinetics for intermetallic compound layer between In-48Sn solder and bare Cu substrate. Journal of Alloys and Compounds 386: 151-156.

Krystyna, B., Janusz, S., Marek, K., Wojciech, N., Anna, M. & Malgorzata, J. 2013. SAC solder with carbon nanotubes. Part II: carbon nanotubes effect on solder joints mechanical properties and microstructure. Soldering & Surface Mount Technology 25(4): 195-208.

Li, Y., Zhao, X., Liu, Y., Wang, Y. & Wang, Y. 2014. Effect of TiO2 addition concentration on the wettability and intermetallic compounds growth of Sn3.0Ag0.5Cu–xTiO2 nano-composite solders. J. Mater. Sci: Mater. Electron. 25(9): 3816-3827.

Liang, Z. & Tu, K.N. 2014. Structure and properties of lead-free solders bearing micro and nano particles. Materials Science and Engineering R 82: 1-32.

Liu, M.L. & Ahmad, A.M. 2013. Interfacial reaction of Sn-Ag-Cu lead-free solder alloy on Cu: A review. Advances in Materials Science and Engineering 2013: Article ID 123697.

Mayappan, R., Yahya, I., Ab Ghani, N.A. & Hamid, H.A. 2014. The effect of adding Zn into the Sn–Ag–Cu solder on the intermetallic growth rate. J. Mater Sci: Mater. Electron. 25(7): 2913-2922.

Mehrabi, K., Khodabakhshi, F., Zareh, E., Shahbazkhan, A. & Simchi, A. 2016. Effect of alumina nanoparticles on the microstructure and mechanical durability of meltspun lead-free solders based on tin alloys. Journal of Alloys and Compounds 688: 143-155.

Nai, S.M.L., Gupta, M. & Wei, J. 2008. Suppressing intermetallic compound growth in SnAgCu solder joints with addition of carbon nanotubes. 2nd IEEE International. pp. 15-19.

Nai, S.M.L., Wei, J. & Gupta, M. 2009. Interfacial intermetallic growth and shear strength of lead-free composite solder joints. Journal of Alloys and Compounds 473: 100-106.

Nor, A.M., Badariah, B. & Ibrahim, A. 2014. Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system. Sains Malaysiana 43(1): 117-122.

Roshanghias, A., Kokabi, A.H., Miyashita, Y., Mutoh, Y. & Madaah, H.H.R. 2013. Formation of intermetallic reaction layer and joining strength in nano-composite solder joint. J. Mater. Sci: Mater. Electron. 24: 839-847.

Ren, S., Yanwei, S., Jiqiu, Q., Fuxiang, W., Yezeng, H., Xiao, C., Qingkun, M. & Zhi, S. 2017. Influence of SnO2 nanoparticles addition on microstructure, thermal analysis and interfacial IMC growth of Sn1.0Ag0.7Cu solder. Journal of Electronic Materials 46(7): 4197-4205.

Tama, F., Chan, Y.C. & Chan, D.K. 2014. Influence of cerium oxide (CeO₂) nanoparticles on the microstructure and hardness of tin–silver–copper (Sn–Ag–Cu) solders on silver (Ag) surface-finished copper (Cu) substrates. J. Mater. Sci: Mater. Electron 25: 5375-5387.

Tan, A.T., Tan, A.W. & Farazila, Y. 2015. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn-Ag-Cu/Cu solder joint during different thermal conditions. Sci. Technol. Adv. Mater. 16(3): 033505.

Tsao, L.C. 2011. Suppressing effect of 0.5 wt.% nano- TiO2 addition into Sn–3.5Ag–0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging. Journal of Alloys and Compounds 509: 8441-8448.

Yang, M., Ji, H.J., Wang, S., Ko, Y.H., Lee, C.W., Wu, J.X. & Li, M.Y. 2016. Effects of Ag content on the interfacial reactions between liquid Sn–Ag–Cu solders and Cu substrates during soldering. Journal of Alloys and Compounds 679: 18-25.

Young, M.K., Kyoung, M.H. & Young, H.K. 2010. Mechanism of the delayed growth of intermetallic compound at the interface between Sn-4.0Ag-0.5Cu and Cu-Zn substrate. Electronic Materials Letters 6(4): 151-154.

 

 

*Pengarang untuk surat-menyurat; email: azmn@ukm.my