Sains Malaysiana 48(6)(2019): 1273–1279

http://dx.doi.org/10.17576/jsm-2019-4806-15

Kesan Gelombang Kejutan terhadap Sifat Mikromekanik Sambungan Pateri SAC 0307/ENiG menggunakan Pendekatan Pelekukan Nano

(Effect of Shock Wave on Micromechanical Properties of SAC 0307/ENiG Solder Joint using Nanoindentation Approach)

MARIA ABU BAKAR1*, AZMAN JALAR^1,2, WAN YUSMAWATI WAN YUSOFF³, NUR SHAFIQA SAFEE³, ARIFFIN ISMAIL³, NORLIZA ISMAIL¹, EMEE MARINA SALLEH¹ & NAJIB SAEDI IBRAHIM⁴

¹Institut Kejuruteraan Mikro dan Nanoelektronik (IMEN), Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Selangor Darul Ehsan, Malaysia

²Pusat Pengajian Fizik Gunaan, Fakulti Sains dan Teknologi, Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Selangor Darul Ehsan, Malaysia

³Pusat Asasi Pertahanan, Universiti Pertahanan Malaysia 3, Kem Sungai Besi, 57000 Kuala Lumpur, Wilayah Persekutuan, Malaysia

⁴Redring Solder (M) Sdn. Bhd., Lot 17486, Jalan Dua, Taman Selayang Baru, 68100 Batu Caves, Selangor Darul Ehsan, Malaysia

Diserahkan: 2 Januari 2019/Diterima: 28 Februari 2019

ABSTRAK

Kebolehharapan dan kebolehtahanan pempakejan elektronik bagi peralatan elektronik dalam bidang ketenteraan adalah menjangkaui kepenggunaan komersial. Kebolehharapan sambungan pateri merupakan perkara asas bagi penilaian prestasi pempakejan elektronik. Ujian kebolehharapan komersial atau konvensional seperti dalam standard JEDEC (Solid State Technology Association) tidak dapat memenuhi keperluan pempakejan elektronik untuk piawaian ketenteraan. Kajian ini melaporkan gerak balas sambungan logam pateri SAC 0307 pada papan litar bercetak (PCB) dengan kemasan permukaan electroless nickel immersion gold (ENiG) terhadap gelombang kejutan hasil daripada ujian letupan secara terbuka. Perubahan sifat mikromekanik dikaji menggunakan pendekatan pelekukan nano. Gelombang kejutan yang berbeza dikenakan pada sambungan pateri dengan menggunakan bahan Emulex dengan dos sebanyak 700 g dan 1500 g. Kekerasan sambungan pateri telah menyusut sebanyak 29% daripada 141 MPa kepada 100 MPa selepas didedahkan pada gelombang kejutan dengan penggunaan dos Emulex sebanyak 1500 g. Modulus terkurang sambungan pateri juga telah menyusut sebanyak 13% daripada 141 GPa kepada 123 GPa dengan penggunaan dos bahan Emulex sebanyak 1500 g. Ujian gelombang kejutan telah menyebabkan berlakunya perubahan pada sifat mikromekanik sambungan pateri iaitu berlakunya kelakuan perlembutan yang melibatkan penyusutan nilai kekerasan dan modulus terkurang. Tiada retak diperhatikan pada antara sambungan pateri-substrat yang menunjukkan bahawa sambungan pateri adalah tidak gagal dan tetap utuh selepas didedahkan pada gelombang kejutan yang tinggi, walaupun berlaku penyusutan sifat mikromekanik yang ketara.

Kata kunci: Bahan pateri Sn-Ag-Cu; gelombang kejutan; pelekukan nano; sambungan pateri; sifat mikromekanik

ABSTRACT

Reliability and durability of electronic packaging for electronic equipment in military application is beyond commercial applicability. The reliability of a solder joint is a key point in assessing the performance of electronic packaging. Commercial or conventional reliability testing such as JEDEC (Solid State Technology Association) standard is unable to fulfill the electronic packaging requirement for military standards. This study reported the response of SAC 0307 solder joint on printed circuit board (PCB) with ENiG surface finish (electroless nickel immersion gold) towards shock waves resulting from an open-field blast test. Micromechanical properties changes were investigated using nanoindentation approach. The solder joints were exposed to shock wave test using different doses of Emulex, 700 g and 1500 g, respectively. The solder joint's hardness has decreased 29% from 141 MPa to 100 MPa after subjected to shock wave using 1500 g Emulex. The shock wave has led to the changes in micromechanical properties of the solder joints in terms of softening behaviour i.e. the decreasing of hardness and reduced modulus values. However, no cracks were observed between solder-substrate indicate that the solder joint is not fail and remains strong after subjected to high shock wave, despite the significant reduction in micromechanical properties.

Keywords: Micromechanical properties; nanoindentation; shock wave; solder joint; solder materials Sn-Ag-Cu

RUJUKAN

Abbas, A., Adil, M., Ahmad, N. & Ahmad, I. 2019. Behavior of reinforced concrete sandwiched panels (RCPs) under blast load. Engineering Structures 181: 476-490.

Abdullah, I., Zulkifli, M.N.A., Jalar, A. & Ismail. R. 2018. Deformation behavior relationship between tensile and nanoindentation tests of SAC305 lead-free solder wire. Soldering & Surface Mount Technology 30(3): 194-202.

Ali, B., Sabri, M.F.M., Jauhari, I. & Sukiman, N.L. 2016. Impact toughness, hardness and shear strength of Fe and Bi added Sn-1Ag-0.5Cu lead-free solders. Microelectronics Reliability 63: 224-230.

An, T., Fang, C., Qin, F., Li, H., Tang, T. & Chen, P. 2018. Failure study of Sn37Pb PBGA solder joints using temperature cycling, random vibration and combined temperature cycling and random vibration tests. Microelectronics Reliability 91: 213-226.

Bakar, M.A., Jalar, A., Daud, A.R., Ismail, R., Lah, N.C.A. & Ibrahim, N.S. 2016. Nanoindentation approach on investigating micromechanical properties of joining from green solder materials. Sains Malaysiana 45(8): 1275-1279.

Coles, L.A., Tilton, C., Roy, A., Shula, A. & Silberschmidt, V.V. 2017. Dynamic damage in woven carbon/epoxy composites due to air blast. Procedia Structural Integrity 6: 5-10.

Che, F.X. & Pang, J.H.L. 2015. Study on reliability of PQFP assembly with lead free solder joints under random vibration test. Microelectronics Reliability 55: 2769-2776.

Chen, D.Q., Zhou, G.Y., Liu, Z.P. & Tu, S.T. 2015. Nanoindentation experimental study on mechanical properties of as-cast BNi-2 solder alloy. Procedia Engineering 130: 652-661.

Cheng, G., Sun, X., Wang, Y., Tay, S.L. & Gao, W. 2017. Nanoindentation study of electrodeposited Ag thin coating: An inverse calculation of anisotropic elastic-plastic properties. Surface & Coatings Technology 310: 43-50.

Eid, A., Foud, A.N. & Durai, E.M. 2016. Effect of adding 0.5 wt% ZnO nanoparticles, temperature and strain rate on tensile properties of Sn-5.0 wt% Sb-0.5 wt% Cu (SSC505) lead free solder alloy. Materials Science and Engineering A 657: 104-114.

Giuranno, D., Delsante, S., Borzone, G. & Novakovic, R. 2016. Effects of Sb addition on the properties of Sn-Ag-Cu/(Cu, Ni) solder systems. Journal of Alloys and Compounds 689: 913-930.

Gu, J., Lin, J., Lei, Y. & Fu, H. 2018. Experimental analysis of Sn-3.0Ag-0.5Cu solder joint board-level drop/vibration impact failure models after thermal/isothermal aging. Microelectronics Reliability 80: 29-36.

Hao, H., Hao, Y., Li, J. & Chen, W. 2016. Review of the current practices in blast-resistant analysis and design of concrete structures. Advances in Structural Engineering 19(8): 1-31.

Hu, X., Li, Y., Liu, Y., Liu, Y. & Min, Z. 2014. Microstructure and shear strength of Sn37Pb/Cu solder joints subjected to isothermal aging. Microelectronics Reliability 54(8): 1575- 1582.

Ignatova, O.N., Kaganova, I.I., Malyshev, A.N., Podurets, A.M., Raevskii, V.A., Skokov, V.I., Tkachenko, M.I., Salishchev, G.A. & Kon’kova, T.N. 2010. Effect of shock wave loading on the internal microstructure and mechanical properties of fine-grained copper. Combustion, Explosion and Shock Waves 46(6): 719-723.

Ismail, N., Jalar, A., Bakar, M.A. & Ismail, R. 2018. Effect of carbon nanotube addition on the growth of intermetallic layer of Sn-Ag-Cu solder system under thermal aging. Sains Malaysiana 47(7): 1585-1590.

Jalar, A., Bakar, M.A., Ismail, R., Ibrahim, N.S. & Ambak, M.A. 2018. Effect of coloured pigment on intermetallic compound growth of Sn-3.0Ag-0.5Cu solder joint. Sains Malaysiana 47(5): 1005-1010.

Kang, M.S., Jeon, Y.J., Kim, D.S. & Shin, Y.E. 2016. Degradation characteristics and Ni3Sn4 IMC growth by a thermal shock test in SAC305 solder joints of MLCCs applied in automotive electronics. International Journal of Precision Engineering and Manufacturing 17(4): 445-452.

Kulkov, S.N., Vorozhtsov, S.A., Komarov, V.F. & Promakhov, V.V. 2013. Structure, phase composition and mechanical properties of aluminium alloys produced by shock-wave compaction. Russian Physics Journal 56(1): 85-89.

Kwon, Y.H., Bang, H.S. & Bang, H.S. 2016. Viscoplasticity behaviour of a solder joint on a drilled Cu pillar bump under thermal cycling using FEA. Journal of Electronic Materials 46(2): 833-840.

Lee, T.K., Ma, H., Liu, K.C. & Xue, J. 2010. Impact of isothermal aging on long-term reliability of fine-pitch ball grid array packages with Sn-Ag-Cu solder interconnects: Surface finish effects. Journal of Electronic Materials 39(12): 2564-2573.

Liu, E., Zhaner, T., Besold, S., Wunderle, B. & Elger, G. 2017. Location resolved transient thermal analysis to investigate crack growth in solder joints. Microelectronics Reliability 79: 533-546.

Marques, V.M.F., Jonston, C. & Grant, P.S. 2014. Microstructural evolution at Cu/Sn-Ag-Cu/Cu and Cu/Sn-Ag-Cu/Ni-Au ball grid array interfaces during thermal ageing. Journal of Alloys and Compounds 613: 387-394.

Mustafa, M., Suhling, J.C. & Lall, P. 2016. Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging. Microelectronics Reliability 56: 136-147.

Myung, W.R., Kim, Y., Kim, K.Y. & Jung, S.B. 2016. Drop reliability of epoxy-contained Sn-58 wt.% Bi solder joint with ENIG and ENEPIG surface finish under temperature and humidity test. Journal of Electronic Materials 45(7): 3651-3658.

Oliver, W.C. & Pharr, G.M. 2004. Measurement of hardness and elastic modulus by instrumented indentation: Advances in understanding and refinements to methodology. Journal of Materials Research 19(1): 3-20.

Rajendran, R. & Lee, J.M. 2009. Blast loaded plates. Marine Structure 22: 99-127.

Seica, M.V., Packer, J.A. & Yankelevsky, D.Z. 2019. Blast and impact loading effects on glass and steel elements and materials. Thin-Walled Structures 134: 384-394.

Sujan, G.K., Haseebm, A.S.M.A., Nishikawa, H. & Amalina, M.A. 2016. Interfacial reaction, ball shear strength and fracture surface analysis of lead-free solder joints prepared using cobalt nanoparticle doped flux. Journal of Alloys and Compounds 695: 981-990.

Santos, W.L.R., Brito, C., Bertelli, F., Spimelli, J.E. & Garcia, A. 2015. Microstructural development of hypoeutectic Zn-(10- 40) wt%Sn solder alloys and impacts of interphase spacing and macrosegregation pattern on hardness. Journal of Alloys and Compounds 647: 989-996.

Wang, F., Huang, Y. & Du, C. 2016. Mechanical properties of SnBi-SnAgCu composition mixed solder joints using bending test. Materials Science & Engineering A 668: 224-233.

Zhang, S. & Paik, K.W. 2016. A study on the failure mechanism and enhanced reliability of Sn58Bi solder anisotropic conductive film joints in a pressure cooker test due to polymer viscoelastic properties and hydroswelling. IEEE Transactions on Components, Packaging and Manufacturing Technology 6(2): 216-223.

*Pengarang untuk surat-menyurat; email: maria@ukm.edu.my