Sains Malaysiana 49(12)(2020): 3037-3044

http://dx.doi.org/10.17576/jsm-2020-4912-15

Effect of Shock Wave on Constant Load Behaviour of Pb-Free/CNT Solder Joint

(Kesan Gelombang Kejutan terhadap Kelakuan Beban Malar Sambungan Pateri Bebas Pb/CNT)

NORLIZA ISMAIL^1,2, AZMAN JALAR^1,2*, WAN YUSMAWATI WAN YUSOFF³, NUR SHAFIQA SAFEE³ & ARIFFIN ISMAIL³

¹Department of Applied Physic, Faculty of Science & Technology, Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Selangor Darul Ehsan, Malaysia

²Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Selangor Darul Ehsan, Malaysia

³Pusat Asasi Pertahanan, Universiti Pertahanan Malaysia (UPNM), Kem Sungai Besi, 57000 Kuala Lumpur, Federal Territory, Malaysia

Diserahkan: 13 Ogos 2020/Diterima: 27 Ogos 2020

ABSTRACT

The constant load behaviour of SAC305 solder joint with addition of carbon nanotube (CNT), exposed to shock wave condition was investigated. Formulated SAC305-CNT solder pastes with 0.04 wt. % CNT were manually printed to the printed circuit board (PCB) with copper surface finish to form solder joint. The solder joint was exposed to the shock wave condition via open field blast air test using Trinitrotoluene (TNT) explosive. Nanoindentation approach was used to determine the constant load behavior of the SAC305-CNT solder joint under shock wave condition. The results showed that addition of CNT reduced the indentation depth of SAC305 solder joint at 10 mN peak load for blast test sample and control sample. Indentation depth displacement of SAC305-CNT solder joint for blast test sample and control sample were reduced about ~ 42 and ~56%, respectively, if compared to the SAC305 solder joint for blast test sample and control sample. SAC305-CNT solder joint was experienced minimal changes of stress exponent when exposed to the shock wave. The existence of CNT in the solder joint slows down the depth displacement due to constant load.

Keywords: Carbon nanotube; constant load behaviour; SAC305-CNT; shock wave; solder joint

ABSTRAK

Kelakuan beban malar sambungan pateri SAC305 dengan penambahan karbon nanotiub (CNT) yang didedahkan kepada keadaan gelombang kejutan telah dikaji. Pes pateri SAC305-CNT yang diformulasi dengan 0.04 % bt. CNT telah dicetak secara manual ke atas papan litar pencetak (PCB) berkemasan kuprum untuk menghasilkan sambungan pateri. Sambungan pateri yang didedahkan kepada keadaan gelombang kejutan melalui ujian letupan udara padang terbuka menggunakan bahan letupan Trinitrotoluena (TNT). Pendekatan pelekukan nano digunakan untuk menentukan sifat kelakuan beban malar sambungan pateri SAC305-CNT pada keadaan gelombang kejutan. Keputusan menunjukkan penambahan CNT mengurangkan kedalaman pelekukan sambungan pateri SAC305-CNT pada beban puncak 10 mN untuk sampel ujian letupan dan sampel kawalan. Perubahan kedalaman pelekukan sambungan pateri SAC305-CNT bagi sampel ujian letupan dan sampel kawalan masing-masing telah berkurang sebanyak ~ 42 dan ~56% jika dibandingkan dengan sambungan pateri SAC305 bagi sampel ujian letupan dan sampel kawalan. Sambungan pateri SAC305-CNT mengalami perubahan eksponen tekanan yang minimum apabila didedahkan kepada gelombang kejutan. Kehadiran CNT di dalam sambungan pateri memperlahankan perubahan kedalaman akibat beban malar.

Kata kunci: Gelombang kejutan; karbon nanotiub; kelakuan beban malar; SAC305-CNT; sambungan pateri

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*Pengarang untuk surat-menyurat; email: azmn@ukm.edu.my