Proceedings of Numerical Analysis in Engineering 2019
|Author||: Shahrum Abdullah, Ahmad Kamal Ariffin, Salvinder Singh Karam Singh Noorhelyna Razali, Muhamad Alias Md. Jedi, Meor Iqram Meor Ahmad|
|Publisher||: Faculty of Engineering and Built Environment|
|Number of Pages||: 128|
|Reference/Download||: Click here|
The 11th International Conference on Numerical Analysis in Engineering (NAE 2019) and the 4th Symposium on Damage Mechanism in Materials and Structures (SDMMS 2019) are organised by the Centre for Integrated Design for Advanced
Mechanical Systems, Universiti Kebangsaan Malaysia and held at Bangi Resort Hotel, Bandar Baru Bangi, Selangor on 20-22nd August 2019. This is the continuity from the success of the previous conferences which was held on August 2017 and December 2018, respectively. The proceedings book of this conference comprises a collection of 57 articles, which covers the fundamental topics and techniques in NAE 2019, such as: heat transfer, nanofluid, engineering application, biomedical, and nanosciences. In addition, SDMMS 2019 covers topics such as: durability, fatigue design, fatigue crack initiation and propagation, life prediction techniques,
computational fracture mechanics, damage assessment, non-destructive testing and structural reliability. This specific knowledge-sharing event successfully gathers researchers from various universities and industries locally and overseas to meet and discuss issues pertaining to numerical analysis in engineering and damage mechanisms in materials and structures. Hence, it provides an opportunity for researchers in these fields to meet and discuss their most recent breakthrough research. Finally, we would like to convey our most sincere appreciation to all participants and keynote speakers for your participation in our conference. We are indebted to the Organising Committee for their relentless efforts in ensuring the success of this symposium. It would not have been possible without the great support from Universiti Kebangsaan Malaysia and also our sponsors, to whom we are most grateful for their kindness.