Institute of Microengineering and Nanoelectronics

 Institute of Microengineering and Nanoelectronics

Publication in Journal (Non Impact)

MEMS & Nanoelectronics Group

  1. Wan Zuha Wan Hasan, Izhal Abdul Halin, Roslina Sidek and Masuri Othman. A fault syndromes simulator for random access memories. European Journal of Scientific Research, Vol. 23, No. 1, pp. 13-24.

Photonics and Nanophotonics Technology Group

  1. Ehsan, A.A., Shaari, S., Abd. Rahman, M.K., Kee Zainal Abidin, K.M.R. Optical code generating device using 1 × N asymmetric hollow waveguide couplers. Guangzi Xuebao/Acta Photonica Sinica 37(5)

Organic  Electronics 

  1. Ashkan Shafiee, Muhammad Mat Salleh and Muhammad Yahaya, Preparation on Manganese(III)5,10,15,20-Tetra(4-Pyridyl)-21H, 23H-Porphine Chloride Tetrakis (Methochloride) Thin Films Using Injet Printing Technique, Solid State Science and Technology Letters, Vol 15, No 2(2008) 10-17 ISSN 0128-8393.
  2. Nurul Huda Yusoff, Muhamad Mat Salleh and Muhammad Yahaya, Fluorescence Gas Sensor Using Ti02 Nanoparticles Coated With Porphyrin Dye Thin Films, Solid State Science and Technology, Vol 16, No 1(2008) 63-74 ISSN 0128-7389.
  3. C.C. Yap, M.Yahaya, M.M. Salleh, Influence of Tetrabutylammonium Hexafluorophosphate (TBAPF6) Doping on The Performance of Polymer Light Emiting Diodes (PLEDs) Based on PVK:PBD Blend Films, Solid State Science and Technology, Vol 16, No 1(2008) 63-74 ISSN 0128-7389.
  4. S.Sepeai, M.M.Salleh, and M.Yahaya, White Light From a Single-Dopant Based on Poly (9,9-DI-N-Hexylfluorenyl-2, 7-Dyl), PHF Doped With Rubrene, Solid State Science and Technology Letters, Vol 15, No 2(2008) 10-17 ISSN 0128-8393.
  5. Syariena Arshad, Muhamad Mat Salleh and Muhammad Yahaya, Quartz Crystal Microbalance Gas Sensor For Detection of Volatile Organic Compounds Using Titanium Dioxide Coated With Dye-Porphyrin, Solid State Science and Technology, Vol 16, No 1(2008) 63-74 ISSN 0128-7389.

Microelectronic Packaging and Materials

  1. A. Jalar, F.M. Nasir, M.A.A. Hamid, N.C Had and N. Ismail, Stereometry Of Voids In Solder Interconect Between PCB And Packaging, Solid State Science and Technology, Vol. 16, No 2 (2008) pg 1-7
  2. A.Jalar, S.H.A. Razak and M.A.A. Hamid, Effects Of Power And Force During Wire Bonding Process On Wire Pull Strength For QFN Stacked Die, Solid State Science and Technology Vol. 16, No 2 (2008) pg 8-14
  3. V.Lim, I.Ahmad, N.Amin, C.S.Foong, T.L.Wong and R.Rasid, Nickel Plated Copper Heat Spreader Surface Characteristics, Solid State Science and Technology, Vol.16, No 2 (2008) pg 15-24
  4. S.Abdullah, Z.A.Aziz, I.Ahmad and M.F. Abdullah, Low Looping Challenges In The QFN Wire Bonding Process,  Solid State Science and Technology, Vol. 16, No 2 (2008) pg 25-32
  5. W.M.S.W. Suliman, W. Shualdi, G.Kenny C.S and A. Isnin, Failure Analysis Of Power MOS Device From The Backside Of The Die, Solid State Science and Technology, Vol. 16, No 2 (2008) pg 33-41
  6. A. Jalar and S.H.A. Razak, Challenge In Free Air Balls Formation Of Copper During Thermosonic Wire Bonding Process, Solid State Science and Technology, Vol. 16, No 2 (2008) pg 42-48
  7. A.E.Said, R.Rasid, S.Ahmad and U. Mokhtar, Effect Of Die Configurations On Warpage Issues For QFN Packages,  Solid State Science and Technology, Vol. 16, No 2 (2008) pg 49-57
  8. W.Shualdi, I.Ahmad, G.Omar and A. Isnin, Effect Of Thermal Aging On The IMC Layer Between Snagsb Solder And Cu Substrate, Solid State Science and Technology, Vol. 16, No 2 (2008) pg 58-64.
  9. A .Jalar, S.A.Radzi and M.A.A. Hamid, Effects Of USG Current And Bonding Load On Bonding Formation In QFN Stacked Die Package, Solid State Science and Technology, Vol. 16, No 2 (2008) pg 65-71.
  10. S. Abdullah, M.F.Abdullah, A.K.Ariffin, M.N. Baharin, Z.A. Aziz and M.F. Mod Yunoh, Effect Of Package Delamination Under 3-Points Bending Test: A Case Study Using Cyclic Loading, Solid State Science and Technology, Vol. 16, No 2 (2008) pg 72-82
  11. U.Mokhtar, R.Rasid, S.Ahmad, A.E.Said, F.L.A. Latip and C.C. Ng, Effect Of Molding Compound And Die Attach Adhesive Material On Qfn Package Delamination And Warpage Issues, Solid State Science and Technology, Vol. 16, No 2 (2008) pg 83-91
  12. W. Shualdi, W.M.S.W.Suliman, A.Isnin and N.A.Mohamad, Constructional Analysis For QFN Stacked Die Failure Identification, Solid State Science and Technology, Vol. 16, No 2 (2008) pg 92-98.
  13. S. Yaakup, H.S.Zakaria, M.A.Hashim and A.Isnin, Tin-Based Lead-Free Solder Bumps For Flip-Chip Application, Solid State Science and Technology, Vol.16, No 2 (2008) pg 99-108.
  14. N.N. Bachok, M.Z.M. Talib and I.Abdullah, Shear Stress Analysis Of Different Stacked Die QFN Package Using FEM, Solid State Science and Technology, Vol. 16, No 2 (2008) pg 109-118.
  15. N.N. Bachok, M.Z.M. Talib, I.Ahmad and I.Abdullah, Reduction of Design Steps For Stacked Die QFN- Using Optimization Technique, Solid State Science and Technology, Vol. 16, No 2 (2008) pg 119-128.
  16. A. Jalar and S. A. Radzi, Some Aspects On Free Air Ball (FAB) Formation Of Copper Wire Bonding, Solid State Science and Technology, Vol. 16, No 2 (2008) pg 129-133.
  17. S. Yaakup, N. S. Shaari, W.N.W. Jaafar and M.A.Hashim, Stencil Printing Technique For Micro-Solder Bumps Patterning, Solid State Science and Technology, Vol. 16, No 2 (2008) pg 134-143.
  18. I.Abdullah, M.Z.M. Talib, I.Ahmad, M.N.B.C. Kamarudin and N. N. Bachok, Reduction Of Warpage Occurrence Stack-Die QFN Through FEA And Statistical Method, Solid State Science and Technology, Vol. 16, No 2 (2008) pg 144-152.
  19. I.Abdullah, I.Ahmad, M.Z.M. Talib, N. N. Bachok, U.Mokhtar and A.E. Said, Warpage And Wire Sweep Analysis Of QFN Molded Array Strip Modeling And Experimental Methods, Solid State Science and Technology, Vol. 16, No 2 (2008) pg 153-163.
  20. S. Abdullah, M.F.Abdullah, A.K. Ariffin, S. Yusof, R. Daud and Z.A.Aziz, Copper Leadframe Analysis Using Thermomechanical Approach, Solid State Science and Technology, Vol. 16, No 2 (2008) pg 164-172.
  21. A.Jalar, M.F. Rosle and M.A.A. Hamid, Effects Of Parameter Match On Boudability And Reliability In Thermosonic Gold Bonding, Solid State Science and Technology, Vol. 16, No 2 (2008) pg 180-188.
  22. U.Mokhtar, R.Rasid, I.Ahmad, Z.Endut, S.Esa and K.Krishnasamy, Investigation Of Warpage Induced On Molded Strip Of QFN Package, Solid State Science and Technology, Vol. 16, No 2 (2008) pg 189-197
  23. S.Abdullah, S.M.Yusof, A. Jalar, M.F. Abdullah, Z. A. Aziz and R. Daud Step Cut for Dicing Laminated Wafer in a QFN Package, Solid State Science and Technology, Vol. 16, No 2 (2008) pg 198-206
  24. F.L.A. Latip, A. Hassan, and R.Yahya Delamination And Void Analysis On Die Attach Epoxy Of A QFN Package,   Solid State Science and Technology, Vol. 16. No 2 (2008) pg 207-213.
  25. M.R.Ismail, W.J. Basirun, Y.K. Tay, Analysis On Geometry And Surface Of 150 um Silicon Wafer After Backgrinding And Wet Etching Process, Solid State Science and Technology, Vol. 16. No 2 (2008) pg 214-222.
  26. S. Abdullah, M.F. Abdullah, A.K. Ariffin, M.N. Baharin, Z. A. Aziz and M.F. Mod Yunoh, Comparison In Between Good And Oxidized Leadframe: A Case Study In Package Delamination Analysis, Solid State Science and Technology, Vol. 16. No 2 (2008) pg 223-231.
  27. S.Abdullah, Z.A.Aziz, I. Ahmad, M.F.Abdullah and M.F. Mod Yunoh, Gold Wire Neck Strength On Different Combinations Of Looping Parameters, Solid State Science and Technology, Vol. 16. No 2 (2008) pg 232-239.
  28. A.Jalar, M.F. Rosle And M.A.A. Hamid, Effects Of Thermal Aging On Intermetallic Compounds And Voids Formation In Aual Wire Bonding, Solid State Science and Technology, Vol. 16. No 2 (2008) pg 240-246.
  29. S. Abdullah, Z.A.Aziz, I.Ahmad, M.F. Abdullah and M.F. Mod Yunoh, Effects Of Looping Formation On Wire Sweeping Problem Of A Newly Developed QFN Package, Solid State Science and Technology, Vol. 16. No 2 (2008) pg 247-254.
  30. N.N. Bachok, M.Z.M. Talib, I. Ahmad and I. Abdullah, Comparison Of 2k Factorial And Taguchi Method To Optimize Design Parameters For QFN Stacked Die, Solid State Science and Technology, Vol. 16. No 2 (2008) pg 255-263.
  31. A.E. Said, R. Rasid, S. Ahmad and U. Mokhtar, Optimization of Package Saw Parameters Using Full Factorial Design in QFN Packages, Solid State Science and Technology, Vol. 16. No 2 (2008) pg 264-271.
Translate »