MEMS/NEMS LAB.

  • Research in this laboratory focuses on the development of high-performance, low-cost, miniature electromechanical and electronic devices. We design and fabricate miniature sensors and actuator systems using CMOS-compatible processes, while research on nanoelectronics emphasizes 2D and carbon-based materials integrated with advanced nanostructures. Other areas of interest include silicon and compound semiconductors, nanometer-scale MEMS devices (NEMS), and MEMS technologies for biomedical applications.

Head of Laboratory

Prof. Dato'. Dr. Burhanuddin Yeop Majlis

burhan@ukm.edu.my

PIC Laboratory

Nurul Izzah Zakaria

nurul_izzah@ukm.edu.my

EQUIPMENT / FACILITIES

Field Emission Scanning Electron Microscopy (Sigma HD FESEM System)

A high-resolution imaging system that uses a field emission electron source to provide detailed surface morphology and structural analysis of materials at the nanoscale.

 

How it works/principle

  • A focused electron beam, generated by a field emission gun (FEG), is scanned across the sample surface under vacuum.
  • Interactions between the electron beam and the sample produce secondary electrons, backscattered electrons, and other signals.
  • These signals are collected and converted into high-resolution images, revealing topography, composition, and surface features.

 

Key features/ advantage

  • Ultra-high resolution imaging of nanostructures and fine surface details.
  • Field emission source provides superior brightness and beam stability.
  • Multiple detectors (secondary, backscattered, EDS) for versatile imaging and elemental analysis.
  • Large depth of field for 3D-like imaging of rough surfaces.
  • User-friendly interface with advanced automation for efficient operation.
  • Suitable for both conductive and non-conductive samples (with coating).

 

Application

  • Nanomaterials characterization (particles, fibers, thin films).
  • Surface morphology and microstructural studies.
  • Failure analysis and defect inspection in semiconductors and devices.
  • Biological sample imaging (with preparation/coating).
  • Correlative imaging with EDS for elemental and compositional analysis.
  • Research in materials science, nanotechnology, life sciences, and microelectronics

A specialized dry etching system utilizing xenon difluoride (XeF₂) gas for isotropic etching of silicon and related materials, widely used in MEMS and semiconductor fabrication.

 

How it works/principle

  • XeF₂ gas is introduced into the etching chamber under vacuum conditions.
  • The gas reacts spontaneously with exposed silicon surfaces to form volatile SiF₄ byproducts, which are removed via the vacuum system.
  • The process is isotropic, highly selective to silicon, and does not require plasma, thus minimizing damage to sensitive structures.

 

Key features/ advantage

  • Plasma-free, room-temperature operation, reducing thermal and ion damage.
  • High selectivity for silicon with negligible attack on common mask materials (SiO₂, Si₃N₄, metals, photoresist).
  • Isotropic etching capability for undercut and release processes.
  • Precise, controllable etch depth through pulsed gas delivery.
  • User-friendly system with automated recipe control and high process reproducibility.

Application

    • MEMS device fabrication (e.g., sacrificial layer release, cavity formation).
    • Silicon undercutting for free-standing structures.
    • Etching of high-aspect-ratio microstructures.
    • Research and development in microelectronics, sensors, and microfluidic devices.
    • Fabrication of complex 3D silicon-based nanostructures.

  • A compact and versatile spin coating system (CY-SP4) designed for producing uniform thin films on substrates with precise control of coating parameters.

     

    How it works/principle

    • A small volume of liquid solution is dispensed onto a substrate.
    • The substrate is spun at controlled speeds, spreading the solution evenly by centrifugal force.
    • The final film thickness and uniformity are determined by spin speed, acceleration, and coating time.

    Key features/ advantage

    • Wide programmable spin speed range with high accuracy and repeatability.
    • Easy-to-use digital control panel for setting speed, acceleration, and duration.
    • Compact footprint, suitable for various lab environments.
    • Compatible with different substrate sizes and materials.
    • Reliable and consistent film deposition for research and development.

     

    Application

    • Deposition of photoresist layers for micro- and nanofabrication.
    • Preparation of polymer, sol-gel, and organic/inorganic thin films.
    • Fabrication of coatings for optoelectronic devices, sensors, and solar cells.
    • Research in nanotechnology, material science and semiconductor processing

     

  • A scanning electron microscope for fast characterization and high-resolution imaging of a wide variety of sample types. 

    • How It Works / Principle It uses a highly focused beam of electrons to scan a sample’s surface. By detecting the scattered or emitted electrons and X-rays, it creates a detailed image and can analyze the sample’s composition.

    • Key Features & Advantages

      • Magnification: 5x to 300,000x

      • High-Voltage Resolution: Up to 3.0 nm

      • Max Sample Size: 150 mm diameter

      • Low Vacuum Mode: Allows for observation of non-conductive samples without coating.

    • Applications Imaging fine features of integrated circuits (ICs) and monitoring the quality of thin films, photoresist patterns, and etching processes at the nanoscale.

  • A scanning electron microscope for fast characterization and high-resolution imaging of a wide variety of sample types. 

    • How It Works / Principle It uses a highly focused beam of electrons to scan a sample’s surface. By detecting the scattered or emitted electrons and X-rays, it creates a detailed image and can analyze the sample’s composition.

    • Key Features & Advantages

      • Magnification: 5x to 300,000x

      • High-Voltage Resolution: Up to 3.0 nm

      • Max Sample Size: 150 mm diameter

      • Low Vacuum Mode: Allows for observation of non-conductive samples without coating.

    • Applications Imaging fine features of integrated circuits (ICs) and monitoring the quality of thin films, photoresist patterns, and etching processes at the nanoscale.

  • A scanning electron microscope for fast characterization and high-resolution imaging of a wide variety of sample types. 

    • How It Works / Principle It uses a highly focused beam of electrons to scan a sample’s surface. By detecting the scattered or emitted electrons and X-rays, it creates a detailed image and can analyze the sample’s composition.

    • Key Features & Advantages

      • Magnification: 5x to 300,000x

      • High-Voltage Resolution: Up to 3.0 nm

      • Max Sample Size: 150 mm diameter

      • Low Vacuum Mode: Allows for observation of non-conductive samples without coating.

    • Applications Imaging fine features of integrated circuits (ICs) and monitoring the quality of thin films, photoresist patterns, and etching processes at the nanoscale.

  • A scanning electron microscope for fast characterization and high-resolution imaging of a wide variety of sample types. 

    • How It Works / Principle It uses a highly focused beam of electrons to scan a sample’s surface. By detecting the scattered or emitted electrons and X-rays, it creates a detailed image and can analyze the sample’s composition.

    • Key Features & Advantages

      • Magnification: 5x to 300,000x

      • High-Voltage Resolution: Up to 3.0 nm

      • Max Sample Size: 150 mm diameter

      • Low Vacuum Mode: Allows for observation of non-conductive samples without coating.

    • Applications Imaging fine features of integrated circuits (ICs) and monitoring the quality of thin films, photoresist patterns, and etching processes at the nanoscale.

  • A scanning electron microscope for fast characterization and high-resolution imaging of a wide variety of sample types. 

    • How It Works / Principle It uses a highly focused beam of electrons to scan a sample’s surface. By detecting the scattered or emitted electrons and X-rays, it creates a detailed image and can analyze the sample’s composition.

    • Key Features & Advantages

      • Magnification: 5x to 300,000x

      • High-Voltage Resolution: Up to 3.0 nm

      • Max Sample Size: 150 mm diameter

      • Low Vacuum Mode: Allows for observation of non-conductive samples without coating.

    • Applications Imaging fine features of integrated circuits (ICs) and monitoring the quality of thin films, photoresist patterns, and etching processes at the nanoscale.

iJANA
lab form