MEMS/NEMS Lab | Institute of Microengineering and Nanoelectronics

MEMS/NEMS LAB.

Research in this laboratory focuses on the development of high-performance, low-cost, miniature electromechanical and electronic devices. We design and fabricate miniature sensors and actuator systems using CMOS-compatible processes, while research on nanoelectronics emphasizes 2D and carbon-based materials integrated with advanced nanostructures. Other areas of interest include silicon and compound semiconductors, nanometer-scale MEMS devices (NEMS), and MEMS technologies for biomedical applications.

Head of Laboratory

Prof. Dato'. Dr. Burhanuddin Yeop Majlis

burhan@ukm.edu.my

PIC Laboratory

Nurul Izzah Zakaria

nurul_izzah@ukm.edu.my

EQUIPMENT / FACILITIES

Field Emission Scanning Electron Microscopy (Sigma HD FESEM System)

A high-resolution imaging system that uses a field emission electron source to provide detailed surface morphology and structural analysis of materials at the nanoscale.

How it works/principle

A focused electron beam, generated by a field emission gun (FEG), is scanned across the sample surface under vacuum.
Interactions between the electron beam and the sample produce secondary electrons, backscattered electrons, and other signals.
These signals are collected and converted into high-resolution images, revealing topography, composition, and surface features.

Key features/ advantage

Ultra-high resolution imaging of nanostructures and fine surface details.
Field emission source provides superior brightness and beam stability.
Multiple detectors (secondary, backscattered, EDS) for versatile imaging and elemental analysis.
Large depth of field for 3D-like imaging of rough surfaces.
User-friendly interface with advanced automation for efficient operation.
Suitable for both conductive and non-conductive samples (with coating).

Application

Nanomaterials characterization (particles, fibers, thin films).
Surface morphology and microstructural studies.
Failure analysis and defect inspection in semiconductors and devices.
Biological sample imaging (with preparation/coating).
Correlative imaging with EDS for elemental and compositional analysis.
Research in materials science, nanotechnology, life sciences, and microelectronics

Xenon Dry Etching System (Samco VPE-4F XeF2 dry etching system)

A specialized dry etching system utilizing xenon difluoride (XeF₂) gas for isotropic etching of silicon and related materials, widely used in MEMS and semiconductor fabrication.

How it works/principle

XeF₂ gas is introduced into the etching chamber under vacuum conditions.
The gas reacts spontaneously with exposed silicon surfaces to form volatile SiF₄ byproducts, which are removed via the vacuum system.
The process is isotropic, highly selective to silicon, and does not require plasma, thus minimizing damage to sensitive structures.

Key features/ advantage

Plasma-free, room-temperature operation, reducing thermal and ion damage.
High selectivity for silicon with negligible attack on common mask materials (SiO₂, Si₃N₄, metals, photoresist).
Isotropic etching capability for undercut and release processes.
Precise, controllable etch depth through pulsed gas delivery.
User-friendly system with automated recipe control and high process reproducibility.

Application

- MEMS device fabrication (e.g., sacrificial layer release, cavity formation).
- Silicon undercutting for free-standing structures.
- Etching of high-aspect-ratio microstructures.
- Research and development in microelectronics, sensors, and microfluidic devices.
- Fabrication of complex 3D silicon-based nanostructures.

Spin Coater (CY-SP4)

A compact and versatile spin coating system (CY-SP4) designed for producing uniform thin films on substrates with precise control of coating parameters.

How it works/principle
- A small volume of liquid solution is dispensed onto a substrate.
- The substrate is spun at controlled speeds, spreading the solution evenly by centrifugal force.
- The final film thickness and uniformity are determined by spin speed, acceleration, and coating time.
Key features/ advantage
- Wide programmable spin speed range with high accuracy and repeatability.
- Easy-to-use digital control panel for setting speed, acceleration, and duration.
- Compact footprint, suitable for various lab environments.
- Compatible with different substrate sizes and materials.
- Reliable and consistent film deposition for research and development.
Application
- Deposition of photoresist layers for micro- and nanofabrication.
- Preparation of polymer, sol-gel, and organic/inorganic thin films.
- Fabrication of coatings for optoelectronic devices, sensors, and solar cells.
- Research in nanotechnology, material science and semiconductor processing

Plasma Sputtering Coater (CY-PSP180G-2TA)

A scanning electron microscope for fast characterization and high-resolution imaging of a wide variety of sample types.
- How It Works / Principle It uses a highly focused beam of electrons to scan a sample’s surface. By detecting the scattered or emitted electrons and X-rays, it creates a detailed image and can analyze the sample’s composition.
- Key Features & Advantages
  - Magnification: 5x to 300,000x
  - High-Voltage Resolution: Up to 3.0 nm
  - Max Sample Size: 150 mm diameter
  - Low Vacuum Mode: Allows for observation of non-conductive samples without coating.
- Applications Imaging fine features of integrated circuits (ICs) and monitoring the quality of thin films, photoresist patterns, and etching processes at the nanoscale.

LCR Meter (GW Instek LCR6020)

A scanning electron microscope for fast characterization and high-resolution imaging of a wide variety of sample types.
- How It Works / Principle It uses a highly focused beam of electrons to scan a sample’s surface. By detecting the scattered or emitted electrons and X-rays, it creates a detailed image and can analyze the sample’s composition.
- Key Features & Advantages
  - Magnification: 5x to 300,000x
  - High-Voltage Resolution: Up to 3.0 nm
  - Max Sample Size: 150 mm diameter
  - Low Vacuum Mode: Allows for observation of non-conductive samples without coating.
- Applications Imaging fine features of integrated circuits (ICs) and monitoring the quality of thin films, photoresist patterns, and etching processes at the nanoscale.

Electron Beam Lithography System (Advanced SEM/FIB Nanolithography)

A scanning electron microscope for fast characterization and high-resolution imaging of a wide variety of sample types.
- How It Works / Principle It uses a highly focused beam of electrons to scan a sample’s surface. By detecting the scattered or emitted electrons and X-rays, it creates a detailed image and can analyze the sample’s composition.
- Key Features & Advantages
  - Magnification: 5x to 300,000x
  - High-Voltage Resolution: Up to 3.0 nm
  - Max Sample Size: 150 mm diameter
  - Low Vacuum Mode: Allows for observation of non-conductive samples without coating.
- Applications Imaging fine features of integrated circuits (ICs) and monitoring the quality of thin films, photoresist patterns, and etching processes at the nanoscale.

Laser Displacement Meter (LC2400A (Keyence)

A scanning electron microscope for fast characterization and high-resolution imaging of a wide variety of sample types.
- How It Works / Principle It uses a highly focused beam of electrons to scan a sample’s surface. By detecting the scattered or emitted electrons and X-rays, it creates a detailed image and can analyze the sample’s composition.
- Key Features & Advantages
  - Magnification: 5x to 300,000x
  - High-Voltage Resolution: Up to 3.0 nm
  - Max Sample Size: 150 mm diameter
  - Low Vacuum Mode: Allows for observation of non-conductive samples without coating.
- Applications Imaging fine features of integrated circuits (ICs) and monitoring the quality of thin films, photoresist patterns, and etching processes at the nanoscale.

Shaker LDS (V406)/ Shaker Controller (LDS B-40)

A scanning electron microscope for fast characterization and high-resolution imaging of a wide variety of sample types.
- How It Works / Principle It uses a highly focused beam of electrons to scan a sample’s surface. By detecting the scattered or emitted electrons and X-rays, it creates a detailed image and can analyze the sample’s composition.
- Key Features & Advantages
  - Magnification: 5x to 300,000x
  - High-Voltage Resolution: Up to 3.0 nm
  - Max Sample Size: 150 mm diameter
  - Low Vacuum Mode: Allows for observation of non-conductive samples without coating.
- Applications Imaging fine features of integrated circuits (ICs) and monitoring the quality of thin films, photoresist patterns, and etching processes at the nanoscale.