{"id":354,"date":"2025-09-28T08:43:14","date_gmt":"2025-09-28T00:43:14","guid":{"rendered":"https:\/\/www.ukm.my\/imen\/?page_id=354"},"modified":"2025-11-27T01:21:36","modified_gmt":"2025-11-26T17:21:36","slug":"microelectronics-packaging-materials-mipac","status":"publish","type":"page","link":"https:\/\/www.ukm.my\/imen\/research-themes\/microelectronics-packaging-materials-mipac\/","title":{"rendered":"Microelectronics Packaging and Materials (MIPAC)"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-page\" data-elementor-id=\"354\" class=\"elementor elementor-354\" data-elementor-post-type=\"page\">\n\t\t\t\t<div data-particle_enable=\"false\" data-particle-mobile-disabled=\"false\" class=\"elementor-element elementor-element-3f85d0c e-flex e-con-boxed e-con e-parent\" data-id=\"3f85d0c\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div data-particle_enable=\"false\" data-particle-mobile-disabled=\"false\" class=\"elementor-element elementor-element-edcbb48 e-con-full e-flex e-con e-child\" data-id=\"edcbb48\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-f754112 eael-dual-header-content-align-center elementor-widget elementor-widget-eael-dual-color-header\" data-id=\"f754112\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"eael-dual-color-header.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t<div class=\"eael-dual-header\">\n\t\t\t\t<h3 class=\"title eael-dch-title\"><span class=\"eael-dch-title-text eael-dch-title-lead lead solid-color\">MIPAC<\/span> <span class=\"eael-dch-title-text\"><\/span><\/h3>\t\t\t\t\t<span class=\"subtext\"><p>Microelectronics Packaging and Materials<\/p><\/span>\n\t\t\t\t\t\t\t<\/div>\n\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-78c03cc elementor-widget elementor-widget-image\" data-id=\"78c03cc\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img decoding=\"async\" src=\"https:\/\/www.ukm.my\/imen\/wp-content\/uploads\/2025\/09\/mipac_cover.png\" title=\"mipac_cover\" alt=\"mipac_cover\" loading=\"lazy\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div data-particle_enable=\"false\" data-particle-mobile-disabled=\"false\" class=\"elementor-element elementor-element-46e2142 e-flex e-con-boxed e-con e-parent\" data-id=\"46e2142\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div data-particle_enable=\"false\" data-particle-mobile-disabled=\"false\" class=\"elementor-element elementor-element-5987776 e-con-full e-flex e-con e-child\" data-id=\"5987776\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-fa1a274 elementor-widget elementor-widget-text-editor\" data-id=\"fa1a274\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>The MIPAC research group has expertise in electronic materials, electronic packaging, package architecture, electronic packaging-related materials, semiconductors, ceramics, insulators, surface interface, and electronic interconnection such as solder joint and wire bonding. The strength of this group is in industry-driven research on various areas such as power packages, automotive packages, high reliability, and anti-corrosion packages. This group has more than 20 years of experience in collaboration with many multinational companies such as Western Digital, Infineon Technologies (Malaysia) Sdn. Bhd, Celestica Malaysia Sdn Bhd, Jabil Penang, Nexperia Malaysia Sdn Bhd, ON Semiconductor Malaysia Sdn Bhd, Freescale Semiconductor Malaysia Sdn Bhd and many more. This group also collaborates with semiconductor package industries, manufacturing vendors, and suppliers of solder materials, epoxy materials, and stencil materials.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div data-particle_enable=\"false\" data-particle-mobile-disabled=\"false\" class=\"elementor-element elementor-element-c02a97f e-flex e-con-boxed e-con e-parent\" data-id=\"c02a97f\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div data-particle_enable=\"false\" data-particle-mobile-disabled=\"false\" class=\"elementor-element elementor-element-a3d0075 e-con-full e-flex e-con e-child\" data-id=\"a3d0075\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-7293130 elementor-widget elementor-widget-heading\" data-id=\"7293130\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h3 class=\"elementor-heading-title elementor-size-default\">RESEARCH TOPICS<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div data-particle_enable=\"false\" data-particle-mobile-disabled=\"false\" class=\"elementor-element elementor-element-490dd93 e-con-full e-flex e-con e-child\" data-id=\"490dd93\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-5b36bd2 elementor-widget elementor-widget-text-editor\" data-id=\"5b36bd2\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<ul><li><span class=\"a_GcMg font-feature-liga-off font-feature-clig-off font-feature-calt-off text-decoration-none text-strikethrough-none\">Low temperature solder and soldering for microelectronic interconnection<\/span><\/li><li><span class=\"a_GcMg font-feature-liga-off font-feature-clig-off font-feature-calt-off text-decoration-none text-strikethrough-none\">Directional growth of intermetallic compound layer in microelectronics metallurgical interconnection<\/span><\/li><li><span class=\"a_GcMg font-feature-liga-off font-feature-clig-off font-feature-calt-off text-decoration-none text-strikethrough-none\">Nanoparticle structural composite modification of IC substrate pallet for thermal multi reflow process<\/span><\/li><li><span class=\"a_GcMg font-feature-liga-off font-feature-clig-off font-feature-calt-off text-decoration-none text-strikethrough-none\">Fabrication and characterisation of edible electronics<\/span><\/li><li><span class=\"a_GcMg font-feature-liga-off font-feature-clig-off font-feature-calt-off text-decoration-none text-strikethrough-none\">Elevated temperature corrosion of copper wire bonding in electronics packaging<\/span><\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div data-particle_enable=\"false\" data-particle-mobile-disabled=\"false\" class=\"elementor-element elementor-element-4ca3035 e-flex e-con-boxed e-con e-parent\" data-id=\"4ca3035\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div data-particle_enable=\"false\" data-particle-mobile-disabled=\"false\" class=\"elementor-element elementor-element-2ffa55a e-con-full e-flex e-con e-child\" data-id=\"2ffa55a\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-eaece65 elementor-widget elementor-widget-heading\" data-id=\"eaece65\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h3 class=\"elementor-heading-title elementor-size-default\">THEME MEMBERS<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div data-particle_enable=\"false\" data-particle-mobile-disabled=\"false\" class=\"elementor-element elementor-element-fe0b3a7 e-con-full e-flex e-con e-child\" data-id=\"fe0b3a7\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-1508460 elementor-widget elementor-widget-eael-team-member-carousel\" data-id=\"1508460\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"eael-team-member-carousel.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t        <div class=\"swiper-container-wrap eael-team-member-carousel-wrap swiper-container-wrap-dots-outside\">\n            <div class=\"swiper swiper-8 eael-tm-wrapper eael-tm-carousel eael-tm-carousel-dots-outside\" id=\"swiper-container-1508460\" data-pagination=\".swiper-pagination-1508460\" data-arrow-next=\".swiper-button-next-1508460\" data-arrow-prev=\".swiper-button-prev-1508460\" data-id=\"swiper-container-1508460\" data-items=\"7\" data-margin=\"7\" data-margin-mobile=\"10\" data-items-tablet=\"2\" data-margin-tablet=\"10\" data-items-mobile=\"3\" data-speed=\"400\" data-autoplay=\"2000\" data-arrows=\"1\" data-dots=\"1\">\n                <div class=\"swiper-wrapper\">\n\t\t\t\t\t                        <div class=\"swiper-slide\">\n                            <div class=\"eael-tm\">\n                                <div class=\"eael-tm-image\">\n\t\t\t\t\t\t\t\t\t<img decoding=\"async\" src=\"https:\/\/www.ukm.my\/imen\/wp-content\/uploads\/2025\/09\/theme_azman-150x150.png\" alt=\"Prof. Dr. Azman Jalar\">\t\t\t\t\t\t\t\t\t                                <\/div>\n\n                                <div class=\"eael-tm-content eael-tm-content-normal\">\n\t\t\t\t\t\t\t\t\t<h4 class=\"eael-tm-name\">Prof. Dr. Azman Jalar<\/h4>\t\t<div class=\"eael-tm-position\">Theme Leader<\/div>\t\t            <div class=\"eael-tm-description\">\n\t\t\t\t\u2022\tMaterials Science\n\u2022\tElectronic Packaging\n\u2022\tElectronic Materials, Structure-Properties-Performance Relationship            <\/div>\n\t\t\t\t        <div class=\"eael-tm-social-links-wrap\">\n            <ul class=\"eael-tm-social-links\">\n\t\t\t\t<li><a href=\"#%20\" aria-label=\"Custom\" target=\"_blank\"><span class=\"eael-tm-social-icon-wrap\"><span class=\"eael-tm-social-icon fas fa-address-book\"><\/span><\/span><\/a><\/li>            <\/ul>\n        <\/div>\n\t\t                                <\/div>\n                            <\/div><!-- .eael-tm -->\n                        <\/div><!-- .swiper-slide -->\n\t\t\t\t\t                        <div class=\"swiper-slide\">\n                            <div class=\"eael-tm\">\n                                <div class=\"eael-tm-image\">\n\t\t\t\t\t\t\t\t\t<img decoding=\"async\" src=\"https:\/\/www.ukm.my\/imen\/wp-content\/uploads\/2025\/09\/theme_ambri-150x150.png\" alt=\"Prof. Dr. Mohd Ambri Mohamed\">\t\t\t\t\t\t\t\t\t                                <\/div>\n\n                                <div class=\"eael-tm-content eael-tm-content-normal\">\n\t\t\t\t\t\t\t\t\t<h4 class=\"eael-tm-name\">Prof. Dr. Mohd Ambri Mohamed<\/h4>\t\t\t\t            <div class=\"eael-tm-description\">\n\t\t\t\t\u2022\tCarbon Electronics\n\u2022\tIII-V Semiconductor\n\u2022\tMBE Technology\n\u2022\tSpintronics\n\n            <\/div>\n\t\t\t\t        <div class=\"eael-tm-social-links-wrap\">\n            <ul class=\"eael-tm-social-links\">\n\t\t\t\t<li><a href=\"#%20\" aria-label=\"Custom\" target=\"_blank\"><span class=\"eael-tm-social-icon-wrap\"><span class=\"eael-tm-social-icon fas fa-address-book\"><\/span><\/span><\/a><\/li>            <\/ul>\n        <\/div>\n\t\t                                <\/div>\n                            <\/div><!-- .eael-tm -->\n                        <\/div><!-- .swiper-slide -->\n\t\t\t\t\t                        <div 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Prof. Dr. Siow Kim Shyong\">\t\t\t\t\t\t\t\t\t                                <\/div>\n\n                                <div class=\"eael-tm-content eael-tm-content-normal\">\n\t\t\t\t\t\t\t\t\t<h4 class=\"eael-tm-name\">Assoc. Prof. Dr. Siow Kim Shyong<\/h4>\t\t\t\t            <div class=\"eael-tm-description\">\n\t\t\t\t\u2022\tSoldering and Sintering\n\u2022\tLow Temperature Metallic Bonding for High Temperature Application in Power Module and Ev\n\u2022\tPlasma Modification\n\u2022\tNanotechnology Biomaterials Plasma \n\n            <\/div>\n\t\t\t\t        <div class=\"eael-tm-social-links-wrap\">\n            <ul class=\"eael-tm-social-links\">\n\t\t\t\t<li><a href=\"#%20\" aria-label=\"Custom\" target=\"_blank\"><span class=\"eael-tm-social-icon-wrap\"><span class=\"eael-tm-social-icon fas fa-address-book\"><\/span><\/span><\/a><\/li>            <\/ul>\n        <\/div>\n\t\t                                <\/div>\n                            <\/div><!-- .eael-tm -->\n                        <\/div><!-- .swiper-slide -->\n\t\t\t\t\t                        <div class=\"swiper-slide\">\n                            <div class=\"eael-tm\">\n                                <div class=\"eael-tm-image\">\n\t\t\t\t\t\t\t\t\t<img decoding=\"async\" src=\"https:\/\/www.ukm.my\/imen\/wp-content\/uploads\/2025\/09\/theme_maria-150x150.png\" alt=\"Dr. Maria Abu Bakar\">\t\t\t\t\t\t\t\t\t                                <\/div>\n\n                                <div class=\"eael-tm-content eael-tm-content-normal\">\n\t\t\t\t\t\t\t\t\t<h4 class=\"eael-tm-name\">Dr. Maria Abu Bakar<\/h4>\t\t<div class=\"eael-tm-position\"> <\/div>\t\t            <div class=\"eael-tm-description\">\n\t\t\t\t\u2022\tElectronic Packaging\n\u2022\tElectronic Materials\n\u2022\tInterconnection materials\n            <\/div>\n\t\t\t\t        <div class=\"eael-tm-social-links-wrap\">\n            <ul class=\"eael-tm-social-links\">\n\t\t\t\t<li><a href=\"https:\/\/www.ukm.my\/imen\/en\/research-fellows\/burhanuddin-yeop-majlis-2\/?lang=en\" aria-label=\"Custom\" target=\"_blank\"><span class=\"eael-tm-social-icon-wrap\"><span class=\"eael-tm-social-icon fas fa-address-book\"><\/span><\/span><\/a><\/li>            <\/ul>\n        <\/div>\n\t\t                                <\/div>\n                            <\/div><!-- .eael-tm -->\n                        <\/div><!-- .swiper-slide -->\n\t\t\t\t\t                        <div class=\"swiper-slide\">\n                            <div class=\"eael-tm\">\n                                <div class=\"eael-tm-image\">\n\t\t\t\t\t\t\t\t\t<img decoding=\"async\" src=\"https:\/\/www.ukm.my\/imen\/wp-content\/uploads\/2025\/09\/theme_atiqah-150x150.png\" alt=\"Dr. Atiqah binti Mohd Afdzaluddin\">\t\t\t\t\t\t\t\t\t                                <\/div>\n\n                                <div class=\"eael-tm-content eael-tm-content-normal\">\n\t\t\t\t\t\t\t\t\t<h4 class=\"eael-tm-name\">Dr. Atiqah binti Mohd Afdzaluddin<\/h4>\t\t<div class=\"eael-tm-position\"> <\/div>\t\t            <div class=\"eael-tm-description\">\n\t\t\t\t\u2022\tMEMS Packaging\n\u2022\tMaterial and Polymer\n\u2022\tComposites            <\/div>\n\t\t\t\t        <div class=\"eael-tm-social-links-wrap\">\n            <ul class=\"eael-tm-social-links\">\n\t\t\t\t<li><a href=\"https:\/\/www.ukm.my\/imen\/en\/research-fellows\/assoc-prof-dr-dee-chang-fu\/?lang=en\" aria-label=\"Custom\" target=\"_blank\"><span class=\"eael-tm-social-icon-wrap\"><span class=\"eael-tm-social-icon fas fa-address-book\"><\/span><\/span><\/a><\/li>            <\/ul>\n        <\/div>\n\t\t                                <\/div>\n                            <\/div><!-- .eael-tm -->\n                        <\/div><!-- .swiper-slide -->\n\t\t\t\t\t                        <div class=\"swiper-slide\">\n                            <div class=\"eael-tm\">\n                                <div class=\"eael-tm-image\">\n\t\t\t\t\t\t\t\t\t<img decoding=\"async\" src=\"https:\/\/www.ukm.my\/imen\/wp-content\/uploads\/2025\/09\/theme_zulhakimi-150x150.png\" alt=\"Dr. Mohd Zulhakimi Ab. Razak\">\t\t\t\t\t\t\t\t\t                                <\/div>\n\n                                <div class=\"eael-tm-content eael-tm-content-normal\">\n\t\t\t\t\t\t\t\t\t<h4 class=\"eael-tm-name\">Dr. Mohd Zulhakimi Ab. Razak<\/h4>\t\t\t\t            <div class=\"eael-tm-description\">\n\t\t\t\t\u2022\tOptoelectronics\n\u2022\tOptical System\n\u2022\tAlgorithm &amp; System Simulation\n\u2022\tIot\n\u2022\tHardware Design, IC Design\n\u2022\tMixed signal &amp; System\n\u2022\tAdaptive Architecture System Design And Integration\n\u2022\tWireless\n\n            <\/div>\n\t\t\t\t        <div class=\"eael-tm-social-links-wrap\">\n            <ul class=\"eael-tm-social-links\">\n\t\t\t\t<li><a href=\"#%20\" aria-label=\"Custom\" target=\"_blank\"><span class=\"eael-tm-social-icon-wrap\"><span class=\"eael-tm-social-icon fas fa-address-book\"><\/span><\/span><\/a><\/li>            <\/ul>\n        <\/div>\n\t\t                                <\/div>\n                            <\/div><!-- .eael-tm -->\n                        <\/div><!-- .swiper-slide -->\n\t\t\t\t\t                        <div class=\"swiper-slide\">\n                            <div class=\"eael-tm\">\n                                <div class=\"eael-tm-image\">\n\t\t\t\t\t\t\t\t\t<img decoding=\"async\" src=\"https:\/\/www.ukm.my\/imen\/wp-content\/uploads\/2025\/09\/theme_raihana-150x150.png\" alt=\"Dr. Raihana Bahru\">\t\t\t\t\t\t\t\t\t                                <\/div>\n\n                                <div class=\"eael-tm-content eael-tm-content-normal\">\n\t\t\t\t\t\t\t\t\t<h4 class=\"eael-tm-name\">Dr. Raihana Bahru<\/h4>\t\t\t\t            <div class=\"eael-tm-description\">\n\t\t\t\t\u2022\tSemiconductor thermal management \n\u2022\tHeat transfer applications \n\u2022\tMaterials chemistry \n\u2022\tNanocarbon materials            <\/div>\n\t\t\t\t        <div class=\"eael-tm-social-links-wrap\">\n            <ul class=\"eael-tm-social-links\">\n\t\t\t\t<li><a href=\"#%20\" aria-label=\"Custom\" target=\"_blank\"><span class=\"eael-tm-social-icon-wrap\"><span class=\"eael-tm-social-icon fas fa-address-book\"><\/span><\/span><\/a><\/li>            <\/ul>\n        <\/div>\n\t\t                               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data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div data-particle_enable=\"false\" data-particle-mobile-disabled=\"false\" class=\"elementor-element elementor-element-6880c92 e-con-full e-flex e-con e-child\" data-id=\"6880c92\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-8ddc1c3 elementor-widget elementor-widget-heading\" data-id=\"8ddc1c3\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h3 class=\"elementor-heading-title elementor-size-default\">RESEARCH LABORATORIES<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div data-particle_enable=\"false\" data-particle-mobile-disabled=\"false\" class=\"elementor-element elementor-element-ab21a09 e-con-full e-flex e-con e-child\" data-id=\"ab21a09\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div 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href=\"https:\/\/www.ukm.my\/imen\/research-themes\/microelectronics-packaging-materials-mipac\/\"> 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