Sains Malaysiana 49(12)(2020): 3255-3259

http://dx.doi.org/10.17576/jsm-2020-4912-36

Effect of Bismuth Additions on Wettability, Intermetallic Compound, and Microhardness Properties of Sn-0.7Cu on Different Surface Finish Substrates

(Kesan Penambahan Bismut kepada Kebasahan, Sebatian antara Logam dan Sifat Mikrokekerasan Sn-0.7Cu terhadap Substrat Akhir Berlainan Kemasan)

MOHD IZRUL IZWAN RAMLI¹, MOHD ARIF ANUAR MOHD SALLEH¹*, SITI FARAHNABILAH MUHD AMLI¹ & NURUL RAZLIANA ABDUL RAZAK²

¹Center of Excellence Geopolymer & Green Technology (CeGeoTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP), Taman Muhibbah, 02600 Jejawi, Perlis, Malaysia

²Department of Mechanical Technology, Faculty of Engineering, Kampus UniCITI Alam Sungai Chuchuh, Padang Besar, 02100 Perlis, Malaysia

Received: 14 August 2020/Accepted: 11 September 2020

ABSTRACT

The influence of bismuth (Bi) addition on wettability, thickness of interfacial intermetallic compound (IMC), and microhardness properties of Sn-0.7Cu + xBi solder alloy using different types of substrate were examined. The 0.5, 1.0, 1.5, and 2.0 wt. % Bi was added into Sn-0.7Cu and fabricated using the casting process. The result shows that the influence of 1.5 wt. % Bi in the Sn-0.7Cu solder soldered on copper organic solderability preservative (Cu-OSP) and immersion tin (Im-Sn) surface finish has improved the wettability and microhardness. Subsequently, the IMC thickness of Sn-0.7Cu+1.5Bi solder alloy on Im-Sn surface finish gives a better result than reflowed on Cu-OSP. Generally, with the addition of 1.5 wt. % Bi in Sn-0.7Cu solder alloy reflowed on the Im-Sn surface finish had enhanced the performance in terms of wettability, thickness of IMC and microhardness properties compared to on Cu-OSP surface finish.

Keywords: Bismuth; solder alloy; surface finish; wettability

ABSTRAK

Dalam kajian ini, kesan penambahan bismut (Bi) terhadap kebasahan, ketebalan antaramuka sebatian antara logam (IMC) dan sifat mikrokekerasan pateri bebas plumbum Sn-0.7Cu + xBi menggunakan pelbagai jenis substrat telah dikaji. Penambahan 0.5, 1.0, 1.5 dan 2.0 bt. % Bismut ke dalam Sn-0,7Cu dibuat menggunakan kaedah peleburan. Hasil kajian menunjukkan bahawa penambahan 1.5 bt. % Bi pateri Sn-0.7Cu yang dipaterikan pada permukaan Cu-OSP dan rendaman timah (ImSn) meningkatkan kebasahan dan mikrokekerasan. Selain itu, ketebalan IMC untuk pateri Sn-0.7Cu + 1.5Bi pada kemasan permukaan Im-Sn memberikan hasil yang lebih baik berbanding aliran semula pada permukaan pada Cu-OSP. Secara keseluruhan, dapat disimpulkan bahawa 1.5 bt. % Bi dalam pateri Sn-0.7Cu yang telah dialirkan semula pada permukaan ImSn telah meningkatkan ciri-ciri kebasahan, ketebalan IMC dan sifat mikrokekerasan berbanding pada permukaan Cu-OSP.

Kata kunci: Aloi pateri; bismut; kebasahan; kemasan permukaan

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*Corresponding author; email: arifanuar@unimap.edu.my