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Sains Malaysiana 47(8)(2018): 1867–1872 http://dx.doi.org/10.17576/jsm-2018-4708-27
Kelakuan Migrasi Elektrokimia Pateri SAC305 dalam Larutan Natrium Hidroksida pada Kepekatan yang Pelbagai
(Electrochemical Migration Behaviour of SAC305 Solder in Various
Concentrations of Sodium Hydroxide Solution)
EMEE MARINA SALLEH1, NORINSAN KAMIL OTHMAN1* & AZMAN JALAR2
1School of Applied Physics, Faculty of Science and Technology,
Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Selangor Darul Ehsan, Malaysia
2Institute of Microengineering and Nanoelectronic (IMEN), Universiti
Kebangsaan Malaysia, 43600 UKM Bangi, Selangor Darul Ehsan, Malaysia
Diserahkan: 5 Oktober 2017/Diterima: 27
April 2018
ABSTRAK
Pengecilan saiz antarahubung dalam
papan litar bercetak (PCB) membawa kepada migrasi
elektrokimia (ECM) dan kemudiannya menyebabkan litar pintas. ECM merupakan
salah satu jenis kakisan yang ketara menjejaskan kebolehtahanan kakisan kepada
peralatan elektronik. Migrasi ini ialah fenomena ion logam bergerak dari satu
kawasan ke kawasan yang lain di dalam medium logam, menyebabkan endapan berlaku
di bahagian katod logam ataupun aloi. Justeru, kajian ini dijalankan untuk
menentukan kelakuan kakisan melalui ujian titisan air (WDT)
pateri bebas plumbum Sn-3.0Ag-0.5Cu (SAC305)
di dalam larutan natrium hidroksida (NaOH) yang berbeza kepekatan iaitu 0.05M,
0.1M, 0.5M dan 1.0M. Purata masa-ke-kegagalan (MTTF)
pateri SAC305 berkurangan apabila
didedahkan kepada medium larutan NaOH yang semakin tinggi kepekatannya.
Pembentukan dendrit dikesan selepas kakisan pateri SAC305 akibat proses ECM dan menyebabkan litar pintas. Hasil kakisan Cu(OH)2 dan
SnO2 juga didapati terbentuk
selepas pateri terkakis. Bopeng kecil kelihatan terbentuk terutamanya pada
kepekatan yang tinggi adalah disebabkan oleh perlarutan pada anod Sn.
Kata kunci: Bahan pateri Sn-Ag-Cu;
kakisan; migrasi elektrokimia; pateri tanpa plumbum; ujian titisan air
ABSTRACT
Miniaturization of the
interconnection size in printed circuit board (PCB) leads
to electrochemical migration (ECM) causing short circuit. ECM is
a form of corrosion which significantly affects the corrosion reliability for
most of the electronic equipment. Migration is a phenomenon in which the
metallic ions are moving from one region to another region of metal, resulting
in metal or alloy deposits at cathodic part. Hence, this study was performed in
order to determine corrosion behaviour of SAC305 solder via water drop test (WDT) in various concentration
of sodium hydroxide (NaOH) included 0.05M, 0.1M, 0.5M and 1.0M. The results
showed that mean time to failure (MTTF) of SAC305 solder reduced when the samples were exposed to higher concentration of NaOH
solution. Formation of dendrite was observed after SAC305 solder corroded due to ECM process
which resulted in short circuit. Corrosion product such as Cu(OH)2 and
SnO2 were formed after the solder
was corroded. Tiny pitting was formed especially at high concentration of NaOH
which was due to dissolution of Sn anode.
Keywords:
Corrosion; electrochemical migration; lead free solder; Sn-Ag-Cu solder
material; water drop test
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*Pengarang untuk surat-menyurat; email: insan@ukm.my
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