Sains Malaysiana 49(10)(2020): 2599-2608

http://dx.doi.org/10.17576/jsm-2020-4910-25

 

Experimental and Numerical Investigation of Fluid Flow and Heat Transfer in Circular Micro-Channel

(Penyelidikan Uji Kaji dan Berangka bagi Aliran Bendalir dan Pemindahan Haba dalam Mikro-Saluran Membulat)

 

ABDULMAJEED ALMANEEA*

 

Department of Mechanical and Industrial Engineering, College of Engineering, Majmaah University, Al-Majmaah, 11952, Saudi Arabia

 

Diserahkan: 28 Oktober 2019/Diterima: 1 Mei 2020

 

ABSTRACT

Nowadays, there is a large demand for many electronic devices such as the laptop, and cell phone. The heat generated by such electronic component increases due to continuous functioning. Implementing microchannel could be a good solution despite the heat from microminiature refrigerators, microelectronics, micro heat pipe spreader, fuel processing biomedical, and aerospace. Therefore, several investigations have been done to improve the performance of such continuous operating electronic devices by dissipating heat with the use of microchannels. In this study, an experimental and numerical investigation is done for the circular microchannel having the hydraulic diameter of 253 µm and 63 mm in length under the condition of constant wall temperature by submerging the microchannels in the oil at constant temperature and water is forced to pass through total 5 microchannels. Experimental conducted for various flow rates shows that the microchannel has a significant impact on the heat transfer rate for the considered flow rate. Numerical results through COMSOL 5.1 software show good agreement with the experimental results. It is observed that the heat transfer coefficient increases with the Reynolds number whereas friction factor decreases with Reynolds number. Based on numerical and experimental results, empirical correlations for friction factor and Nusselt number are suggested to provides a reasonable estimate of heat transfer in the microchannel.

 

Keywords: Friction factor; heat transfer; microchannels; Nusselt number; Reynolds number

 

ABSTRAK

Pada masa ini terdapat banyak permintaan barang peranti elektronik seperti komputer riba dan telefon bimbit. Haba yang dihasilkan oleh komponen elektronik akan meningkat dengan penggunaan secara berterusan. Penggunaan mikrosaluran boleh menjadi penyelesaian yang baik di sebalik haba yang terhasil daripada peti sejuk mikro, mikroelektronik, penyebar paip haba mikro, bioperubatan pemprosesan bahan bakar dan aeroangkasa. Oleh itu, beberapa penyelidikan telah dilakukan untuk meningkatkan prestasi peranti elektronik yang beroperasi secara berterusan melalui pembuangan haba dengan penggunaan mikrosaluran. Dalam kajian ini, penyelidikan secara uji kaji dan berangka telah dijalankan untuk mikrosaluran bulat yang berdiameter 253 µm dan panjang 63 mm di bawah keadaan suhu dinding tetap dengan merendam mikrosaluran dalam minyak pada suhu tetap dan air dipaksa melalui keseluruhan 5 mikrosaluran secara keseluruhan. Uji kaji dijalankan dalam kadar aliran yang berbeza dan ia menunjukkan bahawa mikrosaluran memberi kesan ketara terhadap kadar pemindahan haba untuk kadar aliran yang terpilih. Keputusan berangka menggunakan perisian COMSOL 5.1 menunjukkan perbandingan yang baik dengan keputusan uji kaji. Pemerhatian kajian menunjukkan bahawa pekali pemindahan haba meningkat dengan nombor Reynolds manakala faktor geseran menurun dengan nombor Reynolds. Berdasarkan keputusan berangka dan uji kaji, korelasi empirik untuk faktor geseran dan nombor Nusselt dapat menyarankan anggaran yang bersesuaian dengan pemindahan haba dalam saluran mikro.

 

Kata kunci: Faktor geseran; nombor Nusselt; nombor Reynolds; pemindahan haba; saluran mikro

 

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*Pengarang untuk surat-menyurat; email: a.almaneeea@mu.edu.sa

 

           

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