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Our MEMS Fabrication Laboratory supports the design, fabrication, and characterization of Micro-Electro-Mechanical Systems (MEMS) devices. These micro-devices are created from silicon and similar materials using advanced micromachining processes derived from semiconductor fabrication technology.
The facility features a dedicated cleanroom environment essential for high-precision fabrication.
Total Cleanroom Area: 180 m²
Class 100 Zone: A 40 m² yellow-light area specifically designed for critical processes like photolithography and wafer bonding.
Class 1000 Zone: A 140 m² space for other fabrication and characterization activities.
Originally built in 1995, the cleanroom was significantly upgraded in 2002 to house additional state-of-the-art equipment for MEMS research and development.
burhan@ukm.edu.my
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faizal_imen@ukm.edu.my
A scanning electron microscope for fast characterization and high-resolution imaging of a wide variety of sample types.
How It Works / Principle It uses a highly focused beam of electrons to scan a sample’s surface. By detecting the scattered or emitted electrons and X-rays, it creates a detailed image and can analyze the sample’s composition.
Key Features & Advantages
Magnification: 5x to 300,000x
High-Voltage Resolution: Up to 3.0 nm
Max Sample Size: 150 mm diameter
Low Vacuum Mode: Allows for observation of non-conductive samples without coating.
Applications Imaging fine features of integrated circuits (ICs) and monitoring the quality of thin films, photoresist patterns, and etching processes at the nanoscale.
An advanced spectral reflectance system that maps thin-film thickness quickly and easily.
How It Works / Principle It works on the principle of spectral reflectance (thin-film interference), measuring how light reflects off a thin film to determine its thickness and optical properties (n and k) without touching the sample.
Model : Filmetrics F50-2000
Key Features & Advantages
Automated Stage: Automatically moves to selected measurement points.
High-Speed Measurement: Provides thickness readings in seconds.
Flexible Map Patterns: Can create detailed maps of thickness uniformity across a wafer.
Applications Measures the thickness and refractive index of films like , , polysilicon, and photoresist. Essential for monitoring deposition and etching processes.
A deposition system used to create ultra-thin films with incredible precision for applications in materials science and beyond.
How It Works / Principle PECVD uses plasma energy to decompose precursor gases into reactive species, which then deposit onto a substrate as a thin film.
Key Features & Advantages
Low-Temperature Deposition: Its primary advantage is the ability to deposit high-quality thin films at significantly lower temperatures by using plasma instead of high thermal energy.
Applications Creating thin films for advanced materials, microelectronics, and semiconductors.
A versatile deposition system that creates high-quality thin films with excellent adhesion using precise DC/RF sputtering control.
How It Works / Principle The system utilizes two sputtering techniques, RF (Radio Frequency) and DC (Direct Current) sputtering, within the same chamber to deposit material onto a substrate.
Key Features & Advantages
Dual-Mode Operation: Combines both DC and RF sputtering for maximum flexibility.
High-Quality Films: Offers precise control for versatile deposition, producing films with excellent adhesion.
Applications Creating thin films for advanced materials, electronics, and semiconductor applications.
A Q150RS sputter coater used to apply a thin, electrically conductive gold film onto samples for Scanning Electron Microscopy (SEM).
How It Works / Principle It uses magnetron sputter deposition to apply a conductive layer of gold onto non-conductive samples. This film prevents specimen ‘charging’, reduces thermal damage, and enhances secondary electron emission for clearer imaging in an SEM.
Automated Control: Features a fully automatic touch-and-swipe capacitive color screen for easy operation.
Optimized for SEM: Specifically designed to prepare samples for high-resolution imaging.
Applications General-purpose thin film coating of gold (Au) for SEM sample preparation.
A high-temperature furnace used for thermal oxidation, annealing, and diffusion drive-in processes in semiconductor fabrication.
How It Works / Principle The furnace exposes a silicon wafer to an oxidizing agent (like oxygen or water vapor) in a precisely controlled high-heat environment (up to 1000°C) to grow a uniform layer of silicon dioxide ().
Key Features & Advantages
High-Purity Processing: Designed to achieve ultra-precise control over temperature, atmosphere, and cleanliness.
Uniform Growth: Ensures a uniform, high-quality silicon dioxide layer across the wafer.
Applications Performing dry oxidation processes and high-temperature annealing of wafers.
An advanced etching system used to create high-precision patterns and structures in microfabrication.
How It Works / Principle The process takes place in a vacuum chamber where a plasma is generated. A combination of chemical reaction and physical ion bombardment removes material from the wafer surface.
Key Features & Advantages
Anisotropic Etching: Produces highly directional etching, allowing for the creation of vertical sidewalls and high-aspect-ratio structures.
Applications Etching thin films for advanced materials, microelectronics, and semiconductors.
A high-resolution contact mask aligner designed for laboratory and development environments.
How It Works / Principle It performs high-precision 1:1 contact printing, transferring a pattern from a mask onto a substrate (like a silicon wafer) coated with photoresist.
Key Features & Advantages
High Resolution: Designed for high-resolution photolithography applications.
Substrate Flexibility: Accommodates standard wafers up to 3 inches and non-standard, irregularly shaped substrates.
Applications High-resolution photolithography for R&D and pilot production.
A mask aligner designed to provide precise alignment and exposure of photomasks onto substrates for creating intricate microscopic patterns.
How It Works / Principle It transfers a pattern from a photomask to a substrate coated with a light-sensitive material (photoresist) using a controlled exposure process.
Key Features & Advantages
Precise Control: Equipped with a modern light source and high-precision manual controls for accurate alignment.
Layer-to-Layer Alignment: Critical for devices that are built layer-by-layer, requiring precise alignment of multiple masks.
Applications Photolithography for MEMS devices like sensors and micro-mirrors.
A reliable and user-friendly instrument for applying a uniform coating of photoresist onto substrates.
How It Works / Principle It uses multi-step spin processes where the speed, acceleration, and duration are tightly controlled to spread a liquid evenly across a substrate, achieving a desired film thickness.
Key Features & Advantages
Substrate Size: Up to 3 inches
Max. speed: 8000 RPM
Programmable: Allows for repeatable, multi-step recipes for precise thickness control.
Applications Applying photoresist for photolithography.
A reliable and user-friendly instrument for applying uniform thin films (polymers, photoresists) onto substrates.
How It Works / Principle The process relies on centrifugal force to spread a liquid photoresist and achieve a highly uniform thickness across a substrate, such as a silicon wafer or glass slide.
Key Features & Advantages
Substrate Size: Up to 3 inches
Max. speed: 5000 RPM
Uniform Coatings: Excellent for creating consistent thin films.
Applications Applying photoresist for photolithography.
A versatile test instrument used to accurately measure the Inductance (L), Capacitance (C), and Resistance (R) of electronic components.
How It Works / Principle It applies a known AC voltage at a specific frequency to a component. By measuring the resulting current and the phase shift between the voltage and current, it precisely calculates the L, C, and R values.
Key Features & Advantages
Model: Agilent 4284A
Wide Frequency Range: Allows for testing components under a broad spectrum of operating conditions.
High Speed & Accuracy: Delivers fast and reliable measurements suitable for R&D and quality control.
Applications Quality assurance for passive components (inductors, capacitors, resistors), material characterization, and general electronics testing.
An advanced instrument that performs detailed electrical characterization of semiconductor devices and materials. ⚡
How It Works / Principle It applies precise voltages or currents to a device while simultaneously measuring the resulting electrical response. This allows it to map out the device’s electrical behavior, such as conductivity and capacitance, under various conditions.
Key Features & Advantages
Model: Keithley 4200
Versatile Test Suite: Capable of performing a wide range of automated electrical tests.
Measures: I-V (current-voltage), C-V (capacitance-voltage), and transient (time-varying) characteristics.
Applications Characterizing transistors, diodes, and sensors; failure analysis of electronic components; and research on new semiconductor materials.
A lab instrument used to modify a material’s surface to improve its ability to bond with inks, coatings, or adhesives.
How It Works / Principle The instrument generates a high-voltage electrical field that ionizes the surrounding air, creating a plasma (the “corona”). This plasma bombards the material’s surface, breaking molecular bonds and increasing its surface energy, making it more receptive to adhesion.
Key Features & Advantages
Model: BD-20V (ETP)
Targeted Treatment: Designed for treating small, specific surface areas.
Effective Adhesion Promotion: Significantly increases the surface energy of non-receptive materials like polymers.
Applications Surface treating polymers and other materials before printing, bonding, or coating to ensure strong and lasting adhesion.
A specialized workstation designed for chemical processes like wet etching in a controlled and safe environment. 🧪
How It Works / Principle It uses liquid chemicals (acids or bases) to dissolve and remove unwanted material from a substrate surface. This process, known as isotropic etching, uniformly removes material in all directions.
Key Features & Advantages
Safety Focused: Equipped with dedicated exhaust systems and ventilation to safely remove chemical fumes and vapors.
Controlled Environment: Provides a contained space specifically for handling hazardous liquid chemicals in microfabrication.
Applications Performing wet etching, chemical cleaning of wafers, and other liquid-based chemical processes in semiconductor and MEMS fabrication.
Institute of Microengineering and Nanoelectronics
Level 4, Research Complex,
Universiti Kebangsaan Malaysia,
43000 Bangi
Email: imen@ukm.edu.my
Phone: +603-8911 8020 /
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