The MIPAC research group has expertise in electronic materials, electronic packaging, package architecture, electronic packaging-related materials, semiconductors, ceramics, insulators, surface interface, and electronic interconnection such as solder joint and wire bonding. The strength of this group is in industry-driven research on various areas such as power packages, automotive packages, high reliability, and anti-corrosion packages. This group has more than 20 years of experience in collaboration with many multinational companies such as Western Digital, Infineon Technologies (Malaysia) Sdn. Bhd, Celestica Malaysia Sdn Bhd, Jabil Penang, Nexperia Malaysia Sdn Bhd, ON Semiconductor Malaysia Sdn Bhd, Freescale Semiconductor Malaysia Sdn Bhd and many more. This group also collaborates with semiconductor package industries, manufacturing vendors, and suppliers of solder materials, epoxy materials, and stencil materials.