The continuous pressure to reduce size, weight and cost, while increasing the functionality of portable products, has created a tremendous demand for innovative , cost-effective, IC packaging solutions. While the general expectation is space reduction, each application is typically defined as a package that has more functionality by means of integrating few semiconductor chips either from the same technology or different technologies. Previously, the main attempt to create a value added more functionality package was done using System on Chip (SoC) approach whereby various functionality being formulated and integrated within the same chip to finally perform the intended full final function wanted by users. However, nowadays, the Multy Chip Module (MCM) and Stacked Chip approach became more popular due to cost, flexibility, less technical challenge, Usability of existing infrastructure and other manufacturing, support and technology flexibilities.