Institute of Microengineering and Nanoelectronics

 Institute of Microengineering and Nanoelectronics

Microelectronics Packaging and Materials (MIPAC)


The MIPAC research group has expertise in electronic materials, electronic packaging, package architecture, electronic packaging-related materials, semiconductors, ceramics, insulators, surface interface, and electronic interconnection such as solder joint and wire bonding. The strength of this group is in industry-driven research on various areas such as power packages, automotive packages, high reliability, and anti-corrosion packages. This group has more than 20 years of experience in collaboration with many multinational companies such as Western Digital, Infineon Technologies (Malaysia) Sdn. Bhd, Celestica Malaysia Sdn Bhd, Jabil Penang, Nexperia Malaysia Sdn Bhd, ON Semiconductor Malaysia Sdn Bhd, Freescale Semiconductor Malaysia Sdn Bhd and many more.  This group also collaborates with semiconductor package industries, manufacturing vendors, and suppliers of solder materials, epoxy materials, and stencil materials.

Group Leader

Prof. Dr. Azman Jalar (Materials Science, Electronic Packaging, Electronic Materials, Structure-Properties-Performance Relationship)

Group Members

  • Prof. Dr. Mohd Ambri Mohamed (Molecular Beam Epitaxy, Nano Carbon Electronics, Advanced Functional Materials)
  • Assoc. Prof. Dr. Kim S. Siow (Soldering and Sintering, low Temperature Metallic Bonding for High Temperature Application in Power Module and Ev, Plasma Modification, Nanotechnology Biomaterials Plasma Treatment/polymerization)
  • Dr. Maria Abu Bakar (Electronic Packaging, Electronic Materials, Interconnection materials)
  • Dr. Atiqah binti Mohd Afdzaluddin (Mems Packaging, Material and Polymer, Composites)
  • Dr. Mohd Zulhakimi Ab. Razak  (Optoelectronics, Optical System, Algorithm & System Simulation, Iot, Hardware Design, IC Design, Mixed signal & System, Adaptive Architecture, System Design And Integration, Wireless)
  • Dr. Raihana Bahru (Semiconductor thermal management, Heat transfer applications, Materials chemistry, Nanocarbon materials)

Assoc. Group Members 

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