Institute of Microengineering and Nanoelectronics

 Institute of Microengineering and Nanoelectronics

Fabrication

mems1   mems2   mems3

Deposition

  1. LPCVD Oxidation Three Stack Furnace (KoyoLab)
  2. DWL 66 Laser Write (Heidelberg DWL)
  3. Plasma Enhanced Chemical Vapour Deposition (PECVD)
  4. E-Beam Evaporator (Edwards Auto 306 Turbo)
  5. Metal evaporator (Med 010 Balzers)
  6. Sputter Coater (Baltec SCD-005)
  7. Oxidation Furnace
  8. DC/RF Sputtering System (NTI Nanofilm)

Etching

  1. ICP PlasmaLab System 100 (Deep RIE)
  2. Electrochemical Etch System (MEMS Potentiostat SC)
  3. Plasma Enhanced Chemical Vapour Deposition (RIE)

Lithography

  1. Karl-Suss MJB Mask Aligner (Karl Suss)
  2. Ceramic Hotplate (Fischer Scientific)
  3. Coating Dispensing System – resist spinner (Spin Coater P6700)
  4. Resist Spin Coater (Mikasa SpinCoater 1H-D3)
  5. Thermolyne Hotplate (Thermolyne)
  6. Programmable Spin CoaterOther machines / facilities

Other machines / facilities

  1. Wire bonding system (Kulicke & soffa 4500 Digital series)
  2. Ultrasonic Cleaner (Brinson 1200)
  3. Ozone cleaner (UVO cleaner 144AX-220)
  4. Wafer scriber (Karl Suss)
  5. General purpose oven
  6. DI water system
  7. Portable Liquid N2 tank
  8. Chemical freezer
  9. Wet station
  10. Eye wash station
  11. Fumehood / Wetbench
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